Non-digitized diffractive beam splitters for high-throughput laser materials processing

J. Amako; E. Fujii

doi:10.1117/12.2034598

6 March 2014 Non-digitized diffractive beam splitters for high-throughput laser materials processing

J. Amako, E. Fujii

Proceedings Volume 8968, Laser-based Micro- and Nanoprocessing VIII; 896807 (2014) https://doi.org/10.1117/12.2034598
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

We report a non-digitized diffractive beam splitter with a split count of 45, a 95% splitting efficiency, and a 0.90 splitting uniformity. The splitter was iteratively designed and was created on fused silica by laser writing lithography. Antireflection coatings were added to the splitter to ensure high efficiency. This splitter was applied to the manufacture of inkjet printer heads, in which silicon wafers were drilled with a 532-nm, nanosecond pulse laser with an average output of 10 W and were wet-etched to produce microfluidic channels. We also discuss large beam arrays for process throughput and subwavelength structures formed on the splitter for efficient laser power use.

Citation Download Citation

J. Amako and E. Fujii "Non-digitized diffractive beam splitters for high-throughput laser materials processing", Proc. SPIE 8968, Laser-based Micro- and Nanoprocessing VIII, 896807 (6 March 2014); https://doi.org/10.1117/12.2034598

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