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13 June 2022 ILT for HVM: history, present and future
Danping Peng
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Proceedings Volume PC12051, Optical and EUV Nanolithography XXXV; PC1205106 (2022) https://doi.org/10.1117/12.2616194
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States
Abstract
ILT was developed by the team led by the author starting from 2003; Simulation and wafer printing demonstrated its superiority over traditional Manhattan OPC; But its adoption in HVM was hinder by long run time and long write-time; Almost 20 decades later, with the rise of GPU and ML, and the successful development of MBMW, all the issues have a solution. The author reviewed the history of ILT, survey the current status and provide some personal predictions for ILT in HVM.
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Danping Peng "ILT for HVM: history, present and future", Proc. SPIE PC12051, Optical and EUV Nanolithography XXXV, PC1205106 (13 June 2022); https://doi.org/10.1117/12.2616194
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KEYWORDS
Photomasks
Scanners
Lithography
Polygon scanners
Yield improvement
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