This study introduces Microsphere-Assisted Hyperspectral Imaging (MAHSI), the world’s first metrology system combining microsphere super-resolution and hyperspectral imaging. The system achieves an ultra-small measurement spot size of 14.4 nm and an optical resolution of 66 nm, overcoming the diffraction limit and enabling precise non-destructive measurements of complex 3D semiconductor structures. A high-speed novel autofocus method has been developed specifically for the ultra-close working distances required by microsphere super-resolution optics for the first time. This innovative technique only requires two spectra acquisition, as a result, it can achieve fast and precise approach of the objective lens, ensuring accurate measurements without damaging the sample. The system has successfully monitored the uniformity of cell blocks in DRAM, and demonstrates its feasibility for semiconductor metrology. As semiconductor processes become increasingly refined, the proposed MAHSI system can be innovative and effective solution for encountered metrology and inspection challenges in semiconductor device analysis.
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