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Adam Christensen
at Georgia Institute of Technology
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Publications (1)
Proceedings Article | 14 September 2005 Paper
Thermal design considerations in the packaging of GaN based light emitting diodes
Proceedings Volume 5941, 594118 (2005) https://doi.org/10.1117/12.625956
KEYWORDS: Light emitting diodes, Gallium nitride, Resistance, Thermal effects, Raman spectroscopy, Packaging, Infrared imaging, Temperature metrology, Instrument modeling, Thermal modeling
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