Mr. Adrian Boyle Profile

Adrian Boyle

CEO at Cathx Ocean Ltd

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Publications (1)

Proceedings Article | 12 April 2005 Paper

Laser technology for wafer dicing and microvia drilling for next generation wafers

Richard Toftness, Adrian Boyle, David Gillen

Proceedings Volume 5713, (2005) https://doi.org/10.1117/12.602033

KEYWORDS: Semiconducting wafers, Laser drilling, Laser processing, Dysprosium, Laser applications, Wafer dicing, Silicon, Laser development, Copper, Ultraviolet radiation

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