Reducing hot pixels is a challenge commonly faced in the image sensor industry and there are various techniques used to
address this problem, including image processing and process optimization. This paper discusses an approach to reduce
hot pixels by using Technology Computer Aided Design (TCAD) simulations to optimize the pixel at the process level.
A correlation between empirical hot pixel data and simulated electric field is discussed. For this given process, there is
good correlation between hot pixel count and the electric field along the top p-n junction of the photodiode. By
optimizing the top p-n junction, we were able to reduce the hot pixel count to less than 100ppm at 45C for a threshold
value of 15% of full scale. However, careful consideration must be made during the process optimization. When
photodiode implant doses and energies are changed, image lag performance can deteriorate. Changing photodiode
implant doses and energies can also result in n-type penetration through the polysilicon gate, which can lead to increased
dark current. A careful design will avoid such problems. During our process optimization, we successfully reduced hot
pixel count while still achieving low dark current. These achievements can be observed in dark current of less than 3 e-
/sec-pixel at 45C.
There is a need for semiconductor based UV photodetectors to support avalanche gain in order to realize better performance and more effectively compete with existing photomultiplier tubes. However, there are numerous technical issues associated with the realization of high-quality solar-blind avalanche photodiodes (APDs). In this paper, APDs operating at 280 nm, within the solar-blind region of the ultraviolet spectrum, are investigated. The devices consist of an Al0.38Ga0.62N active region grown atop a high quality AlN template layer designed to allow back illumination of the devices through the sapphire substrate. These devices perform well in the unbiased mode of operation. Under the application of large reverse bias these devices show a soft breakdown starting at relatively low electric fields. The devices achieve a maximum optical gain of ~1000 at a reverse bias of ~90 Volts, which corresponds to an electric field strength of 2.5 MV/cm. The origins of this gain are discussed in detail and modeling of the devices is used to investigate the electric field build up in the multiplication region.
Back-illuminated solar-blind ultraviolet p-i-n photodetectors and focal plane arrays are investigated. We initially study single-pixel devices and then discuss the hybridization to a read-out integrated circuit to form focal plane arrays for solar-blind UV imaging. The photodetectors consist of an AlGaN p-i-n active region grown atop a high quality AlN template layer with a ~1 μm thick Al0.5Ga0.5N:Si-In co-doped low-resistance UV-transparent lateral conduction layer. The material is processed into a 320 x 256 array of 25 μm x 25 μm pixels using standard lithographic techniques. Typical pixels demonstrate a peak responsivity of 93 mA/W at 278 nm; this corresponds to an external quantum efficiency of 42%. The uniformity of the array is discussed, and a selection of sample images from the solar-blind focal plane array is included. In addition, recent attempts to achieve shorter wavelength deep UV back-illuminated p-i-n photodetector and focal plane arrays are also discussed.
GaN-based optoelectronic devices are plagued by a tendency to non-radiative transitions linked to defects in the active layers. This problem has its origin in (1) intrinsic factors such as GaN's relatively low exciton binding energy (~24meV) and (2) extrinsic factors including the poor availability of native substrates good enough to significantly suppress the defect density. Indeed, the quality and availability of large-area bulk GaN substrates is currently considered a key problem for the continuing development of improved GaN-based devices. Since development of bulk GaN substrates of suitable quality has proven very difficult, a considerable amount of effort is also being directed towards the development of alternative substrates which offer advantages compared to those in widespread use (c-sapphire and 6H SiC). ZnO is promising as a substrate material for GaN because it has the same wurtzite structure and a relatively small lattice mismatch (~1.8%). In this paper, we discuss use of ZnO thin films as templates for GaN based LED.
We report on the growth and fabrication of AlGaN-based deep ultraviolet light-emitting diodes (LEDs) with peak emission of below 255 nm. In order to achieve such short wavelength UV LEDs, the Al mole fractions in the device layers should be greater than ~60%. This introdues serious challenges on the growth and doping of AlxGa1-xN epilayers. However, with the aid of a high-quality AlN template layer and refinement of the growth conditions we have been able to demonstrate UV LEDs emitting below 255 nm. The ratio of the intensity of the electroluminescence primary peak to that of the secondary peak (related to Mg deep levels) is ~ 18:1 at moderate injection current levels. Milliwatt level output powers have been achieved for these deep UV LEDs.
We demonstrate high power AlGaN based ultraviolet light-emitting diodes (UV LEDs) with an emission wavelength of 280 nm using an asymmetric single quantum well active layer configuration on top of a high-quality AlGaN/AlN template layer grown by metalorganic chemical vapor deposition (MOCVD). An output power of 1.8 mW at a pulsed current of 400 mA was achieved for a single 300 μm × 300 μm diode. This device reached a high peak external quantum efficiency of 0.24% at 40 mA. An array of four diodes produced 6.5 mW at 880 mA of pulsed current. We also demonstrate high output power operation of AlGaN-based UV LEDs at a short wavelength of 265 nm. An output power of 2.4 mW at a pulsed current of 360 mA was achieved for a single diode. A packaged array of four diodes produced 5.3 mW at 700 mA of pulsed current. The DC output power is 170 μW at 250 mA.
We report AlGaN-based back-illuminated solar-blind p-i-n photodetectors with a record peak responsivity of 150 mA/W at 280 nm, corresponding to a high external quantum efficiency of 68%, increasing to 74% under 5 volts reverse bias. Through optimization of the p-AlGaN layer, we were able to remove the out-of-band negative photoresponse originating from the Schottky-like p-type metal contact, and hence significantly improve the degree of solar-blindness. We attribute the high efficiency of these devices to the use of very-high quality AlN and Al0.87Ga0.13N/AlN superlattice material, a highly conductive Si-In co-doped Al0.5Ga0.5N layer, and the elimination of the negative photoresponse through improvement of the p-type AlGaN.
Thanks to advances in the quality of wide bandgap AlxGa1-xN semiconductors, these materials have emerged as the most promising approach for the realization of photon detectors operating in the near ultraviolet from 200 to 365 nm. This has in turn spurred the need for such devices in an increasing number of applications ranging from water purification to early missile threat warning systems. Nevertheless, the control of the material quality and doping, and the device technology remain tremendous challenges in the quest for the realization of high performance photodetectors. Design of the photodetector structure is one of the key issues in obtaining high performance devices; especially the thickness of the intrinsic region for p-i-n photodiodes is a crucial value and needs to be optimized. We compare the performance of the p-i-n photodiodes with different widths for the depletion region, which shows a trade-off between speed and responsivity of the devices. Furthermore, another challenge at present is the realization of low resistivity wide bandgap p-type AlxGa1-xN semiconductors. We present here recent advances and propose future research efforts in the enhancement of the AlxGa1-xN p-type conductivity through the use of polarization fields in AlxGa1-xN/GaN superlattice structures.
There has been a growing interest for the development of solar blind ultraviolet (UV) photodetectors for use in a variety of applications, including early missile threat warning, flame monitoring, UV radiation monitoring and chemical/biological reagent detection. The AlxGa1-xN material system has emerged as the most promising approach for such devices. However, the control of the material quality and the device technology are still rather immature. We report here the metalorganic chemical vapor deposition, the n-type and the p-type doping of high quality AlxGa1-xN thin films on sapphire substrates over a wide range of Al concentration. The quality of this AlxGa1-xN material was verified through the demonstration of high performance visible and solar blind ultraviolet p-i-n photodiodes with a cut-off wavelength continuously tunable from 227 to 365 nm, internal quantum efficiencies up to 86% when operated in photovoltaic mode, and a ultraviolet-to-visible rejection ratio as high as six orders of magnitude. Both front and back side illuminated p-i-n photodiodes were realized. Photodetector devices were also demonstrated on GaN material obtained using lateral epitaxial overgrowth. The technology for such AlxGa1-xN based devices was improved in an effort to enhance their performance, including the development of ohmic metal contacts to both n-type and p-type AlxGa1-xN films with an Al concentration up to 40%.
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