Mr. Dong Hou Profile

Dong Hou

GS Product Line Manager at Focuslight Technologies Inc

SPIE Involvement:

Author

Proceedings Article | 27 November 2023 Paper

High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, Xingsheng Liu

Proceedings Volume 12761, 127610N (2023) https://doi.org/10.1117/12.2687224

KEYWORDS: Semiconductor lasers, High power lasers, Laser soldering, Laser bonding, Reliability, Design and modelling, Surgery, Solid state lasers, Scientific research, Packaging

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Proceedings Article | 27 December 2022 Presentation + Paper

Generation mechanics and reduction of "smile" of conduction cooled diode bars during the annealing process

Lingling Xiong, Hui Liu, Jinhua Han, Dong Hou, Lei Gao, Xuejie Liang

Proceedings Volume 12311, 1231108 (2022) https://doi.org/10.1117/12.2641743

KEYWORDS: Annealing, Indium

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Proceedings Article | 4 March 2022 Poster + Presentation + Paper

Development of diode laser stack with high power and long pulse width for medical aesthetic application

Junli Li, Tuanwei Fu, Dong Hou, Jingwei Wang, Yunzhu Chen, Yanfang Zheng, Chungen Zah, Xingsheng Liu

Proceedings Volume 11983, 119830R (2022) https://doi.org/10.1117/12.2608522

KEYWORDS: Semiconductor lasers, Resistance, Convection, Reliability, Laser development, Thermal modeling, Pulsed laser operation, Laser bonding, High power lasers

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Proceedings Article | 9 October 2021 Paper

Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder

Jingwei Wang, Tuanwei Fu, Dong Hou, Lijun Gao, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910D (2021) https://doi.org/10.1117/12.2602338

KEYWORDS: Semiconductor lasers, Packaging, High power diode lasers, Near field, Continuous wave operation, Heatsinks

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Proceedings Article | 4 March 2019 Presentation + Paper

Development of high power annular diode laser array using hard solder

Dong Hou, Lichen Sun, Tuanwei Fu, Li Chen, Xuejie Liang, Lei Cai, Yan Yang, Jingwei Wang, Minna Yan, Chungen Zah, Xingsheng Liu

Proceedings Volume 10899, 108990A (2019) https://doi.org/10.1117/12.2510023

KEYWORDS: Semiconductor lasers, High power lasers, Packaging, Dielectrics, Optical simulations, Gallium arsenide, Copper, Laser development, Structural design, Optical isolators

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Proceedings Article | 20 February 2018 Paper

High power multiple wavelength diode laser stack for DPSSL application without temperature control

Dong Hou, Xia Yin, Jingwei Wang, Shi Chen, Yun Zhan, Xiaoning Li, Yingmin Fan, Xingsheng Liu

Proceedings Volume 10513, 1051311 (2018) https://doi.org/10.1117/12.2291169

KEYWORDS: Semiconductor lasers, Absorption, Solid state lasers, Temperature metrology, Nd:YAG lasers, Crystals, Resistance, High power lasers, Laser development, Heatsinks

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Proceedings Article | 22 April 2016 Paper

Packaging of hard solder 500W QCW diode laser array

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9730, 97300D (2016) https://doi.org/10.1117/12.2213977

KEYWORDS: Semiconductor lasers, Packaging, High power lasers, Reliability, Copper, Laser bonding, Near field, High power diode lasers, Laser systems engineering

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Proceedings Article | 22 April 2016 Paper

High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, Xingsheng Liu

Proceedings Volume 9730, 973009 (2016) https://doi.org/10.1117/12.2213928

KEYWORDS: Semiconductor lasers, High power diode lasers, Laser development, Indium, Resistance, Reliability, High power lasers, Numerical simulations, Gold

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Proceedings Article | 20 February 2015 Paper

Effect of interface layer on the performance of high power diode laser arrays

Pu Zhang, Jingwei Wang, Lingling Xiong, Xiaoning Li, Dong Hou, Xingsheng Liu

Proceedings Volume 9346, 934607 (2015) https://doi.org/10.1117/12.2077029

KEYWORDS: High power diode lasers, Semiconductor lasers, Interfaces, Finite element methods, Packaging, Laser development, Numerical simulations, Thermal effects, Copper, Reliability

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Proceedings Article | 20 February 2015 Paper

Advances in bonding technology for high power diode laser bars

Jingwei Wang, Xiaoning Li, Dong Hou, Feifei Feng, Yalong Liu, Xingsheng Liu

Proceedings Volume 9346, 934605 (2015) https://doi.org/10.1117/12.2079619

KEYWORDS: Semiconductor lasers, High power diode lasers, Indium, Liquids, Heatsinks, Reliability, Packaging, Laser bonding, Laser welding, Laser applications

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Proceedings Article | 20 February 2015 Paper

High power diode laser stack development using gold-tin bonding technology

Dong Hou, Jingwei Wang, Pu Zhang, Lei Cai, Ye Dai, Yingjie Li, Xingsheng Liu

Proceedings Volume 9346, 934604 (2015) https://doi.org/10.1117/12.2079610

KEYWORDS: Semiconductor lasers, Reliability, Laser development, Pulsed laser operation, Heatsinks, Indium, Packaging, High power diode lasers, High power lasers, Numerical simulations

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Proceedings Article | 3 February 2015 Paper

Packaging of complete indium-free high reliable and high power diode laser array

Jingwei Wang, Xiaoning Li, Feifei Feng, Yalong Liu, Dong Hou, Xingsheng Liu

Proceedings Volume 9255, 92550X (2015) https://doi.org/10.1117/12.2072357

KEYWORDS: Semiconductor lasers, High power diode lasers, Packaging, Indium, Copper, Heatsinks, Reliability, Laser bonding, Optical simulations, Laser development

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Proceedings Article | 3 February 2015 Paper

A 3000W 808nm QCW G-stack semiconductor laser array

Pu Zhang, Jingwei Wang, Dong Hou, Zhenfu Wang, Lingling Xiong, Hui Liu, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9255, 92550W (2015) https://doi.org/10.1117/12.2065663

KEYWORDS: Semiconductor lasers, Heatsinks, High power lasers, Finite element methods, Reliability, Copper, Laser development, Optical simulations, Indium, Laser welding

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Showing 5 of 13 publications

Conference Committee Involvement (1)

Components and Packaging for Laser Systems XI

27 January 2025 | San Francisco, California, United States

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