Dongmin Kyeon
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 27 April 2023 Presentation + Paper
Proceedings Volume 12496, 124961F (2023) https://doi.org/10.1117/12.2657062
KEYWORDS: Intelligence systems, Semiconducting wafers, Deep learning, 3D metrology, Hyperspectral imaging, Etching, Metrology, 3D modeling, Imaging spectroscopy, Defect detection

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