Prof. Frank Niklaus Profile

Prof. Frank Niklaus

Research Associate at KTH Royal Institute of Technology

SPIE Involvement:

Author

Publications (20)

Proceedings Article | 20 June 2024 Presentation + Paper

Design of a miniaturized MID-IR spectroscopy solution, based on a 400 nm SiPh platform, for the detection of CO2 and CH4

Georgios Syriopoulos, Charalampos Zervos, Giannis Poulopoulos, Evrydiki Kyriazi, Thenia Prousalidi, Pen-Sheng Lin, Frank Niklaus, Kristinn Gylfason, Nour Negm, Stephan Suckow, Max Lemme, Dimitris Apostolopoulos, Hercules Avramopoulos

Proceedings Volume 12999, 129990N (2024) https://doi.org/10.1117/12.3022431

KEYWORDS: Waveguides, Reflectors, Silicon, Design, Bragg wavelengths, Bragg gratings, Mid infrared, Spectroscopy, Refractive index

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Proceedings Article | 9 March 2024 Presentation

Building general-purpose programmable photonic chips: opportunities and challenges

Wim Bogaerts, Hong Deng, Xiangfeng Chen, Lukas Van Iseghem, Iman Zand, Yu Zhang, Yichen Liu, Aladdin Alhaffar, Pierre Edinger, Gaehun Jo, Alain Yuji Takabayashi, Arun Kumar Mallik, Cleitus Antony, Jing Zhang, Emadreza Soltanian, Peter Verheyen, Jeroen Beeckman, Günther Roelkens, Niels Quack, Frank Niklaus, Kristinn Gylfason, Umar Khan

Proceedings Volume PC12890, PC128900T (2024) https://doi.org/10.1117/12.3009922

KEYWORDS: Power consumption, Photonic integrated circuits, Packaging, Integrated optics, Electro optics, Analog electronics, Silicon photonics, Silicon, Signal processing, Photonic microstructures

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Proceedings Article | 15 March 2023 Presentation + Paper

Low-power actuators for programmable photonic processors

Umar Khan, Iman Zand, Lukas Van Iseghem, Pierre Edinger, Gaehun Jo, Simon Bleiker, Alain Yuji Takabayashi, Cleitus Antony, Moises Jezzini, Giuseppe Talli, Hamed Sattari, Jun Su Lee, Arun Kumar Mallik, Peter Verheyen, Cristina Lerma Arce, Marco Garcia, Tigers Jonuzi, Ewout Picavet, K. P. Nagarjun, Jan Watté, Niels Quack, Frank Niklaus, Kristinn Gylfason, Klaartje De Buysser, Jeroen Beeckman, Wim Bogaerts

Proceedings Volume 12438, 124380K (2023) https://doi.org/10.1117/12.2647371

KEYWORDS: Waveguides, Microelectromechanical systems, Phase shifts, Liquid crystals, Silicon photonics, Silicon, Photonic integrated circuits, Electrodes, Oxides, Back end of line

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Proceedings Article | 13 March 2023 Presentation + Paper

Scaling programmable silicon photonics circuits

Wim Bogaerts, K. Nagarjun, Lukas Van Iseghem, Xiangfeng Chen, Hong Deng, Iman Zand, Yu Zhang, Yichen Liu, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Pierre Edinger, Gaehun Jo, Simon Bleiker, Kristinn Gylfason, Frank Niklaus, Arun Kumar Mallik, Moises Jezzini, Cleitus Antony, Giuseppe Talli, Peter Verheyen, Jeroen Beeckman, Umar Khan

Proceedings Volume 12426, 1242601 (2023) https://doi.org/10.1117/12.2647293

KEYWORDS: Waveguides, Photonic integrated circuits, Phase shifts, Silicon photonics, Actuators, Microelectromechanical systems, Electro optics, Tunable filters, Integrated optics, Design and modelling

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Proceedings Article | 26 May 2022 Presentation + Paper

MORPHIC: MEMS enhanced silicon photonics for programmable photonics

Umar Khan, Iman Zand, Pierre Edinger, Gaehun Jo, Simon Bleiker, Alain Yuji Takabayashi, Cleitus Antony, Moises Jezzini, Giuseppe Talli, Hamed Sattari, Jun Su Lee, Arun Kumar Mallik, Peter Verheyen, Saurav Kumar, Cristina Lerma Arce, Marco Garcia, Tigers Jonuzi, Jan Watte, Niels Quack, Frank Niklaus, Kristinn Gylfason, Wim Bogaerts

Proceedings Volume 12148, 121480H (2022) https://doi.org/10.1117/12.2631231

KEYWORDS: Microelectromechanical systems, Silicon photonics, Photonics, Phase shifts, Waveguides, Silicon, Photonic integrated circuits, Scanning electron microscopy, Electronics, Semiconducting wafers

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Proceedings Article | 5 March 2022 Presentation + Paper

Wafer-scale integration of layered 2D materials by adhesive wafer bonding

Arne Quellmalz, Simon Sawallich, Maximilian Prechtl, Oliver Hartwig, Georg Duesberg, Max Lemme, Frank Niklaus, Kristinn Gylfason

Proceedings Volume 12003, 1200304 (2022) https://doi.org/10.1117/12.2605116

KEYWORDS: Graphene, Semiconducting wafers, Adhesives, Molybdenum, Heterojunctions, Wafer bonding, Chemical vapor deposition, Silicon, Raman spectroscopy, Resistance, Optoelectronics integration, Very large scale integration

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Proceedings Article | 5 March 2022 Presentation + Paper

Programmable silicon photonic circuits powered by MEMS

Wim Bogaerts, Alain Yuji Takabayashi, Pierre Edinger, Gaehun Jo, Iman Zand, Peter Verheyen, Moises Jezzini, Hamed Sattari, Giuseppe Talli, Cleitus Antony, Mehrdad Saei, Cristina Lerma Arce, Jun Su Lee, Arun Kumar Mallik, Saurav Kumar, Marco Garcia, Tigers Jonuzi, Kristinn Gylfason, Niels Quack, Frank Niklaus, Umar Khan

Proceedings Volume 12005, 1200509 (2022) https://doi.org/10.1117/12.2614213

KEYWORDS: Waveguides, Microelectromechanical systems, Silicon photonics, Silicon, Photonics, Phase shifts, Electronics, Photonic integrated circuits, Packaging, Actuators

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Proceedings Article | 5 March 2021 Presentation + Paper

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn Gylfason, Frank Niklaus

Proceedings Volume 11691, 116910E (2021) https://doi.org/10.1117/12.2582975

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Proceedings Article | 26 February 2020 Presentation + Paper

MORPHIC: programmable photonic circuits enabled by silicon photonic MEMS

Wim Bogaerts, Hamed Sattari, Pierre Edinger, Alain Yuji Takabayashi, Iman Zand, Xiaojing Wang, Antonio Ribeiro, Moises Jezzini, Carlos Errando-Herranz, Giuseppe Talli, Kumar Saurav, Marco Garcia Porcel, Peter Verheyen, Banafsheh Abasahl, Frank Niklaus, Niels Quack, Kristinn Gylfason, Peter O'Brien, Umar Khan

Proceedings Volume 11285, 1128503 (2020) https://doi.org/10.1117/12.2540934

KEYWORDS: Microelectromechanical systems, Waveguides, Photonic integrated circuits, Silicon photonics, Electronics, Actuators, Packaging

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Proceedings Article | 22 February 2018 Presentation + Paper

New dynamic silicon photonic components enabled by MEMS technology

Carlos Errando-Herranz, Pierre Edinger, Marco Colangelo, Joel Björk, Samy Ahmed, Göran Stemme, Frank Niklaus, Kristinn Gylfason

Proceedings Volume 10537, 1053711 (2018) https://doi.org/10.1117/12.2297588

KEYWORDS: Waveguides, Microelectromechanical systems, Silicon, Silicon photonics, Dispersion, Resonators, Etching, Tunable filters, Dry etching, Integrated optics

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Proceedings Article | 21 May 2011 Paper

Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays

Per Ericsson, Andreas Fischer, Fredrik Forsberg, Niclas Roxhed, Björn Samel, Susan Savage, Göran Stemme, Stanley Wissmar, Olof Öberg, Frank Niklaus

Proceedings Volume 8012, 801216 (2011) https://doi.org/10.1117/12.883827

KEYWORDS: Bolometers, Absorption, Quantum wells, Semiconducting wafers, Silicon, Sensors, Resistance, Infrared radiation, Reflectors, Wafer bonding

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Proceedings Article | 14 May 2010 Paper

Low-cost uncooled microbolometers for thermal imaging

Niclas Roxhed, Frank Niklaus, Andreas Fischer, Fredrik Forsberg, Linda Höglund, Per Ericsson, Björn Samel, Stanley Wissmar, Anders Elfving, Tor Ivar Simonsen, Kaiying Wang, Nils Hoivik

Proceedings Volume 7726, 772611 (2010) https://doi.org/10.1117/12.855752

KEYWORDS: Bolometers, Semiconducting wafers, Wafer bonding, Germanium, Tin, Infrared bolometers, Copper, Readout integrated circuits, Microelectromechanical systems, Quantum wells

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Cost efficient integration technologies and materials for manufacturing of uncooled infrared bolometer focal plane arrays (FPA) are presented. The technology platform enables 320x240 pixel resolution with a pitch down to 20 μm and very low NETD. A heterogeneous 3D MEMS integration technology called SOIC (Silicon-On-Integrated-Circuit) is used to combine high performance Si/SiGe bolometers with state-of-the-art electronic read-out-integrated-circuits. The SOIC integration process consists of: (a) Separate fabrication of the CMOS wafer and the MEMS wafer. (b) Adhesive wafer bonding. (c) Sacrificial removal of the MEMS handle wafer. (d) Via-hole etching. (e) Via formation and MEMS device definition. (f) Sacrificial etching of the polymer adhesive. We will present an optimized process flow that only contains dry etch processes for the critical process steps. Thus, extremely small, sub-micrometer feature sizes and vias can be implemented for the infrared bolometer arrays. The Si/SiGe thermistor is grown epitaxially, forming a mono-crystalline multi layer structure. The temperature coefficient of resistance (TCR) is primarily controlled by the concentration of Ge present in the strained SiGe layers. TCR values of more than 3%/K can be achieved with a low signal-to-noise ratio due to the mono-crystalline nature of the material. In addition to its excellent electrical properties, the thermistor material is thermally stable up to temperatures above 600 °C, thus enabling the novel integration and packaging techniques described in this paper. Vacuum sealing at the wafer level reduces the overall costs compared to encapsulation after die singulation. Wafer bonding is performed using a Cu-Sn based metallic bonding process followed by getter activation at ≥350 °C achieving a pressure in the 0.001 mbar range. After assembling, the final metal phases are stable and fully compatible with hightemperature processes. Hermeticity over the product lifetime is accomplished by well-controlled electro-deposition of metal layers, optimized bonding parameters and a suitable bond frame design.

Proceedings Article | 7 May 2009 Paper

A low-noise readout circuit in 0.35-µm CMOS for low-cost uncooled FPA infrared network camera

Behzad Mesgarzadeh, M. Reza Sadeghifar, Per Fredriksson, Christer Jansson, Frank Niklaus, Atila Alvandpour

Proceedings Volume 7298, 72982F (2009) https://doi.org/10.1117/12.819826

KEYWORDS: Bolometers, Infrared radiation, Readout integrated circuits, Sensors, Infrared imaging, Staring arrays, Thermography, Infrared cameras, Infrared bolometers, Infrared sensors

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Proceedings Article | 19 February 2009 Paper

Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Fabian Zimmer, Frank Niklaus, Martin Lapisa, Thomas Ludewig, Martin Bring, Martin Friedrichs, Thor Bakke, Harald Schenk, Wouter van der Wijngaart

Proceedings Volume 7208, 720807 (2009) https://doi.org/10.1117/12.808694

KEYWORDS: Silicon, Semiconducting wafers, Mirrors, Micromirrors, Wafer bonding, Adhesives, Oxides, Etching, Electrodes, Metals

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Proceedings Article | 4 January 2008 Paper

MEMS-based uncooled infrared bolometer arrays: a review

Frank Niklaus, Christian Vieider, Henrik Jakobsen

Proceedings Volume 6836, 68360D (2008) https://doi.org/10.1117/12.755128

KEYWORDS: Bolometers, Infrared bolometers, Readout integrated circuits, Semiconducting wafers, Infrared radiation, Infrared imaging, Wafer bonding, Staring arrays, Resistance, Silicon

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Proceedings Article | 13 June 2007 Paper

Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere: performance model and tradeoffs

Frank Niklaus, Christer Jansson, Adit Decharat, Jan-Erik Källhammer, Håkan Pettersson, Göran Stemme

Proceedings Volume 6542, 65421M (2007) https://doi.org/10.1117/12.719163

KEYWORDS: Bolometers, Readout integrated circuits, Infrared bolometers, Infrared radiation, Infrared imaging, Thermal modeling, Semiconducting wafers, Atmospheric modeling, Performance modeling, Wafer bonding

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Proceedings Article | 14 May 2007 Paper

Low-cost far infrared bolometer camera for automotive use

Christian Vieider, Stanley Wissmar, Per Ericsson, Urban Halldin, Frank Niklaus, Göran Stemme, Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Henrik Jakobsen, Terje Kvisterøy, John Franks, Jan VanNylen, Hans Vercammen, Annick VanHulsel

Proceedings Volume 6542, 65421L (2007) https://doi.org/10.1117/12.721272

KEYWORDS: Semiconducting wafers, Bolometers, Sensors, Readout integrated circuits, Wafer bonding, Germanium, Cameras, Packaging, Quantum wells, Far infrared

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Proceedings Article | 21 April 2006 Paper

Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets

Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Stéphane Junique, Susan Savage, Christian Vieider, Jan Andersson, John Franks, Jan Van Nylen, Hans Vercammen, Terje Kvisterøy, Frank Niklaus, Göran Stemme

Proceedings Volume 6198, 619809 (2006) https://doi.org/10.1117/12.663152

KEYWORDS: Long wavelength infrared, Sensors, Germanium, Semiconducting wafers, Bolometers, Wafer bonding, Manufacturing, Cameras, Readout integrated circuits, Packaging

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Proceedings Article | 30 August 2004 Paper

Characterization of transfer-bonded silicon bolometer arrays

Frank Niklaus, Johan Pejnefors, Matteo Dainese, Michael Haggblad, Per-Erik Hellstrom, Ulf Wallgren, Goran Stemme

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.565894

KEYWORDS: Bolometers, Silicon, Semiconducting wafers, Readout integrated circuits, Infrared detectors, Resistors, Infrared bolometers, Material characterization, Wafer bonding, Boron

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