Ms. Fumiko Iwao Profile

Fumiko Iwao

at Tokyo Electron AT Ltd

SPIE Involvement:

Author

Publications (9)

Proceedings Article | 20 March 2015 Paper

Driving DSA into volume manufacturing

Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Makoto Muramatsu, Etsuo Iijima, Vinayak Rastogi, Takeo Nakano, Fumiko Iwao, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano

Proceedings Volume 9425, 94250Q (2015) https://doi.org/10.1117/12.2085776

KEYWORDS: Etching, Semiconducting wafers, Optical lithography, Polymethylmethacrylate, Line edge roughness, Manufacturing, Image processing, Ecosystems, Line width roughness, Directed self assembly

Read Abstract +

Proceedings Article | 20 March 2012 Paper

High-etching selectivity of spin-on-carbon hard mask process for 22nm node and beyond

Fumiko Iwao, Satoru Shimura, Hideharu Kyouda, Kenichi Oyama, Shohei Yamauchi, Arisa Hara, Sakurako Natori, Hidetami Yaegashi

Proceedings Volume 8325, 832525 (2012) https://doi.org/10.1117/12.916326

KEYWORDS: Etching, Silica, System on a chip, Photoresist processing, Photomasks, Extreme ultraviolet lithography, Scanning electron microscopy, Line edge roughness, Carbon, Particles

Read Abstract +

Proceedings Article | 8 April 2011 Paper

Availability of underlayer application to EUV process

Hitoshi Kosugi, Carlos Fonseca, Fumiko Iwao, Hiroshi Marumoto, Hyun-Woo Kim, Kyoungyong Cho, Cheol-Hong Park, Chang-Min Park, Hai-Sub Na, Cha-Won Koh, Hanku Cho

Proceedings Volume 7969, 79692E (2011) https://doi.org/10.1117/12.878730

KEYWORDS: Coating, Semiconducting wafers, Contamination, Extreme ultraviolet, Data modeling, Calibration, Extreme ultraviolet lithography, Scanning electron microscopy, Etching, Thin films

Read Abstract +

Proceedings Article | 30 March 2010 Paper

The optimizations of resist shrink process using track-based technology

Yoshihiro Kondo, Atsushi Ookouchi, Toyohisa Tsuruda, Masahiro Yamamoto, Takasi Saito, Tsuyoshi Shibata, Satoru Shimura, Fumiko Iwao, Ben Rathsack, Michael Carcasi

Proceedings Volume 7639, 76390X (2010) https://doi.org/10.1117/12.846497

KEYWORDS: Photoresist processing, Line width roughness, Etching, Semiconducting wafers, Double patterning technology, Diffusion, Image processing, Thin film coatings, Critical dimension metrology, Particles

Read Abstract +

Proceedings Article | 11 December 2009 Paper

Implementation of double patterning process toward 22-nm node

Hidetami Yaegashi, Eiichi Nisimura, Kazuhide Hasebe, Tetsu Kawasaki, Masato Kushibiki, Arisa Hara, Shoichi Yamauchi, Sakurako Natori, Nakajima Shigeru, Hiroki Murakami, Kazuo Yabe, Satoru Shimura, Fumiko Iwao, Kenichi Oyama

Proceedings Volume 7520, 75201E (2009) https://doi.org/10.1117/12.839826

KEYWORDS: Double patterning technology, Photoresist processing, Silica, Resolution enhancement technologies, Photoresist materials, Etching, Line width roughness, Lithography, Atomic layer deposition, Optical lithography

Read Abstract +

Proceedings Article | 1 April 2009 Paper

Important challenges for line-width-roughness reduction

Hidetami Yaegashi, M. Kushibiki, E. Nishimura, S. Shimura, F. Iwao, T. Kawasaki, K. Hasebe, H. Murakami, A. Hara, K. Yabe

Proceedings Volume 7273, 72732H (2009) https://doi.org/10.1117/12.814126

KEYWORDS: Line width roughness, Etching, Double patterning technology, Silica, Photomasks, Scanners, Lithography, Optical lithography, Chemical vapor deposition, Overlay metrology

Read Abstract +

Proceedings Article | 1 April 2009 Paper

Fabrication of 22-nm poly-silicon gate using resist shrink technology

Fumiko Iwao, Satoru Shimura, Tetsu Kawasaki, Masato Kushibiki, Nishimura Eiichi

Proceedings Volume 7273, 72730G (2009) https://doi.org/10.1117/12.814365

KEYWORDS: Photoresist processing, Double patterning technology, Line width roughness, Etching, Optical lithography, Immersion lithography, Photoresist materials, Semiconducting wafers, Lithography, Extreme ultraviolet lithography

Read Abstract +

Proceedings Article | 15 April 2008 Paper

Advanced resist process enabling implementation of CD controllability for 32 nm and beyond

Satoru Shimura, Fumiko Iwao, Tetsu Kawasaki, Dunn Shannon, Yoshitsugu Tanaka, Hidetami Yaegashi, Yoshiaki Yamada

Proceedings Volume 6923, 69233C (2008) https://doi.org/10.1117/12.771867

KEYWORDS: Double patterning technology, Photoresist processing, Immersion lithography, Resistance, Extreme ultraviolet, Optical lithography, Thin film deposition, Semiconductors, 193nm lithography, Lithography

Read Abstract +

Proceedings Article | 26 March 2008 Paper

Fabrication of 32-nm contact/via hole by photolithographic-friendly method

Tetsu Kawasaki, Satoru Shimura, Fumiko Iwao, Eiichi Nishimura, Masato Kushibiki, Kazuhide Hasebe, Michael Carcasi, Mark Somervell, Steven Scheer, Hidetami Yaegashi

Proceedings Volume 6923, 692333 (2008) https://doi.org/10.1117/12.771907

KEYWORDS: Reactive ion etching, Chemical vapor deposition, Semiconductors, Lithography, Immersion lithography, Etching, 193nm lithography, Photoresist processing, Photoresist materials, Double patterning technology

Read Abstract +

Showing 5 of 9 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years