We review the fabrication process of a recently introduced phase only MEMS based spatial light modulators for
maskless lithography. A brief description of this device is presented. The physical properties of its structural layers and
the difficulties encountered during its fabrication process are described in detail.
We demonstrate a technique to print. high-density windows using attenuated phase shift mask, negative photoresist and ArF exposure tool and compare our result with that obtained using a binary mask and positive photoresists.
Post exposure bake (PEB) models in the STORM program have been extended to study pattern formation in 193 nm chemically amplified resists. Applications to resists formulated with cycloolefin-maleic anhydride copolymers, cholate based dissolution inhibitor, nonaflate photoacid generator and base quencher are presented. The PEB modeling is based on the chemical and physical mechanisms including the thermally induced deprotection reaction, acid loss due to base neutralization and protected-sites-enhanced acid diffusion. Simplifying assumptions are made to derive analytical expressions for PEB. The model parameters are extracted from the following experiments. UV-visible spectroscopy is used to extract the resist absorbance parameters. The generation of acid is monitored using the method of 'base additions.' The extent of deprotection that occurs during the bake is determined by monitoring the characteristic FTIR absorbance band around 1170 cm-1 over a range of exposure doses and bake temperatures. Diffusion parameters are extracted from line end shortening (LES) measurements. These parameters are optimized using the Method of Feasible Directions algorithm. Application results show good agreement with experimental data for different LES features.
Sub-resolution assist features can significantly improve depth of focus and uniformity of critical dimensions of contact windows especially when combined with appropriately optimized conditions. In this paper, the placement and dimension control of assist features for 160nm contact windows are studied and analyzed using 193 nm lithography in conjunction with state-of-the-art single layer resist. Our study is based on comparison of simulation and experimental data obtained form critical dimension measurements with varying exposure dose, focus, and in different environments. Computer simulations are performed using such commercial lithography software tools as Prolith and Solid-C. Along with optical proximity corrections, we use different conventional and off-axis illumination conditions which increases depth of focus of contact windows and improves the overall process latitude. A test photomask with different configurations of contact windows with and without assist features has been specifically designed for this study. The results have shown that when used with appropriate illumination conditions, especially quadrupole off-axis, sub-resolution assist features increase the depth of focus of contact windows by about 0.3 micrometers , significantly decrease the proximity effects, and improve the overall process latitude.
The properties of sub-resolution assist features for 193nm wavelength contact window lithography have been investigated. A test mask consisting of a variety of window and assist feature sizes and pattern density environments was fabricated and printed. Windows, 160nm in diameter, where exposed in conventional and quadrupole off-axis illumination. Results show a substantial increase in depth- of-focus when quadruple illumination and assist features were employed, when compared to conventional illumination and standard contacts. The improved process latitude is especially apparent in thicker resist formulations, which are required for etching. By employing improved resists with assist features and quadrupole illumination, isolated 160 nm contacts have been fabricated in 510 nm thick resist on 1000 nm SiO2, without anti-reflective coatings. The depth-of- focus is approximately 0.5 microns. BY lowering the numerical aperture of the projection optics, the measured depth-of-focus is unchanged, but assist feature printing can be significantly reduced. Preliminary results of 160 nm windows etched into oxide show that resist loss may be unacceptable with conventional pattern transfer processes.
Raymond Cirelli, J. Bude, William Mansfield, G. Timp, Fred Klemens, Pat Watson, Gary Weber, James Sweeney, Francis Houlihan, Allen Gabor, Fred Baumann, M. Buonanno, G. Forsyth, D. Barr, T. Lee, C. Rafferty, Richard Hutton, Allen Timko, J. Hergenrother, Elsa Reichmanis, Lloyd Harriott, S. Hillenius, Omkaram Nalamasu
We describe the fabrication of the world's smallest fully functional conventional non-volatile memory device using 193 nm lithography for all levels. The cell area of the smallest devices fabricated was 0.0896 micrometers 2. The critical level of the device, to define the channel length, was exposed with an alternating aperture phase shift mask. Floating gate dimensions ranged from 0.080 to 0.14 micrometers . Subsequent lithography, to define the control gate utilized a binary mask with gate dimensions down to 0.16 micrometers . A multi-layer ARC was used to reduce substrate reflections and maintain linewidth control over topography. All levels were exposed with a new single layer chemically amplified resist developed for 193 nm lithography. We will present results for line width control, etch bias, implementation of resolution enhancement techniques as well as issues with process integration.
Combining assist features with appropriate off-axis illumination conditions can significantly improve depth of focus and uniformity of critical dimensions of contact windows. It is known that sub-resolution assist features modify the environment of isolated features in a fashion that they appear dense. In recent years the impact of assist features was mostly studied for gate-level lithography. In this paper the placement and dimension control of assist features for contact windows are examined and analyzed using 193 nm lithography in conjunction with a state-of-the-art single layer resist. Our study is primarily done for 160 nm contact windows, and it is based on experimental data obtained from critical dimension measurements with varying focus, exposure dose, and in different environments. Along with optical proximity corrections we use off-axis illumination technique which increases depth of focus of contact windows and improves the overall process latitude. Specifically for this study we have designed a test photomask with different geometries and pattern densities of contact windows with and without assist features to be used at 193 nm wavelength. To study the proximity effects, different sizes of assist features were used as well as the distances of assists from the main feature were varied. The results have shown that while increasing the process latitude for the primary feature using assist slots in combination with off-axis illumination, the resist thickness and contrast are limiting the assist feature dimensions that can be used. Assist features appear to significantly increase critical dimension uniformity of the contact windows when using both conventional and off-axis illumination techniques, and they dramatically increase the common exposure dose latitude for contact windows with densities from near-isolated to dense, decreasing the proximity effects. Assist feature technique combined with quadrupole illumination demonstrates about 0.3 micron improvement in depth of focus for every type contact window pattern used.
Sub-resolution assist features, coupled with appropriate off- axis illumination conditions, have been studied with the goal of fabricating 200 and 240 nm contact windows with uniform critical dimensions over a range of pitches and with large depths of focus (DOF). Results show that 240 nm isolated contacts without assist features possessed a useful DOF of less than 0.4 microns. The same features with 140 nm assist slots on each window edge, located 190 nm away, possessed a DOF of over 0.8 microns, using quadrupole illumination. Soft quadrupole illumination, where a mixture of quadrupole and conventional illumination is employed, yielded nearly the same DOF as quadrupole and printed both semi-dense and isolated contact windows near their optimum size as well. Contact holes, 200 nm wide, have been printed with smaller sub- resolution features, soft quadrupole illumination, and higher performance resists with a DOF of over 0.6 microns using a stepper with a numerical aperture of 0.53.
We report on a novel technique for tuning the illumination of a lithography tool through the use of variable transmission apertures. In conjunction with this illumination technique, we have developed simulation software capable of identifying the optimum source plane coherence and intensity distribution to increase process latitude. This 'system' approach is capable of analyzing features specific to a given device level, or selected subsets of structure types within a given level. The fabrication of the aperture involves selectively depositing (alpha) -C onto a quartz plate that is inserted into the illuminator. Experimental testing has shown this film to be stable in its optical properties with extended exposure to DUV light. A description of the simulation software, aperture fabrication techniques, materials used, and experimental results for several aperture configurations are reported.
Pat Watson, Joseph Garofalo, M. Hansen, Ilya Grodnensky, Ludwik Zych, R. Takahashi, Willie Yarbrough, Edward Ehrlacher, A. Reim, R. Vella, A. Dunbar, Albert Colina, B. Herrero, D. Castro
The feasibility of manufacturing 280 nm gates for ASIC technology using i-line lithography is examined. Off-axis illumination, sub-resolution assist features and proximity effect bias corrections were considered. The experiments were performed with a reticle designed to evaluate the effects of line pitch, bias and field uniformity on the feature dimensions. Results show that dense and isolated features were found to print at about the same linewidth under all three illumination conditions. However, deviations as large as 40 nm were found at intermediate pitches, implying that some form of optical proximity correction is needed to maintain critical dimension (CD) control for a mask pattern with varying feature densities. Sub-resolution assist lines adjacent to isolated 280 nm lines significantly improved the apparent wall angle of the features compared to true isolated features. The use of these features comes at a cost; the sub-resolution features can be printed under certain conditions and could possibly lead to device failure. Multi-dimensional matrices of CD measurements with varying dose, focus, bias and pitch, when displayed in an appropriate manner, are being used to identify the relative advantages of different illumination conditions. Off-axis illumination offers a large depth of focus for all pitches if proximity effect biasing is applied. Conventional illumination with biasing can improve exposure latitude.
Warren Waskiewicz, Christopher Biddick, Myrtle Blakey, Kevin Brady, Ron Camarda, Wayne Connelly, A. Crorken, J. Custy, R. DeMarco, Reginald Farrow, Joseph Felker, Linus Fetter, Richard Freeman, Lloyd Harriott, Leslie Hopkins, Harold Huggins, Richard Kasica, Chester Knurek, Joseph Kraus, James Liddle, Masis Mkrtchyan, Anthony Novembre, Milton Peabody, Len Rutberg, Harry Wade, Pat Watson, Kurt Werder, David Windt, Regine Tarascon-Auriol, Steven Berger, Stephen Bowler
We have designed, constructed, and are now performing experiments with a proof-of-concept projection electron-beam lithography system based upon the SCALPELR (scattering with angular limitation projection electron-beam lithography) principle. This initial design has enabled us to demonstrate the feasibility of not only the electron optics, but also the scattering mask and resist platform. In this paper we report on some preliminary results which indicate the lithographic potential and benefits of this technology for the production of sub-0.18 micrometer features.
When considering optical lithography, there is no true substitute for the resolution enhancements afforded by a reduction in actinic radiation. However, as we move below 365 nm i-line systems, the optics and attendant materials considerations become acute. Additionally, there is an obvious economic impetus to breath new life into existing exposure systems. Various optical enhancement schemes have been developed over the past few years for these and other reasons. While many of these are well suited for the patterns and economics of memories, there are a few that enable sub 0.5 kl ASIC imaging. These include: large NA, optical proximity correction, and the deployment of sub- resolution assist features. We will demonstrate a blend of these that will support 280 nm ASIC pattern delineation with i-line (365 nm) systems and binary (non-phase-shift) masks.
Steven Berger, Christopher Biddick, Myrtle Blakey, Kevin Bolan, Stephen Bowler, Kevin Brady, Ron Camarda, Wayne Connelly, Reginald Farrow, Joseph Felker, Linus Fetter, Lloyd Harriott, Harold Huggins, Joseph Kraus, James Liddle, Masis Mkrtchyan, Anthony Novembre, Milton Peabody, Thomas Russell, Wayne Simpson, Regine Tarascon-Auriol, Harry Wade, Warren Waskiewicz, Pat Watson
We have proposed an approach to projection electron beam lithography, termed the SCALPEL system, which we believe offers solutions to previous problems associated with projection electron beam lithography.
James Liddle, Myrtle Blakey, Kevin Bolan, Reginald Farrow, Linus Fetter, Leslie Hopkins, Harold Huggins, Herschel Marchman, Milton Peabody, Wayne Simpson, Regine Tarascon-Auriol, Pat Watson
The concept of a mask for a projection electron-beam lithography, based on the difference in scattering between two electron transparent materials -- SCALPELTM, has been demonstrated previously. In order to translate this initial proof-of-concept int a mask suitable for a real lithography system, it is necessary to address a large number of issues. Because of the thin membranes employed, the design of the mask, its fabrication, robustness and dimensional stability are critical issues. Cleaning and repair strategies are also affected by the mask structure. Patterning, inspection and metrology are also vital to the production of a viable mask, but these are areas of importance common to all advanced lithographies.
GexSi1-x infrared detectors grown by Rapid Thermal CVD are demonstrated. External quantum efficiency of 7% at (lambda) equals 1.32 micrometers and eye-diagram at 1.5 Gbit/s are obtained for Ge.29Si.71 waveguide pin detectors. It is shown that external quantum efficiency is limited by fiber to waveguide coupling efficiency. These, along with system considerations suggest that with further improvements, such devices can be used in Si- based monolithic optoelectronic receivers.
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