Silicon photonics is now considered the photonics platform of choice for short-reach data center single mode pluggable transceivers. With the emergence of co-packaged optics concepts, it can also enable high performance computing with power-efficient interconnect, but also Lidar system integration or even optical quantum computing. In this paper we will present an overview of what can be achieved in state-of-the-art silicon photonics platforms and we will discuss some of the emerging technology trends. In particular, we will discuss the integration of LPCVD SiN in an active silicon photonics platform.
We demonstrate a new post-processing approach to efficiently couple light in silicon nitride (Si3N4) photonic integrated circuits (PIC) via grating couplers. Thin-film coupons of apodised Si3N4 grating couplers functionalized with metallic bottom reflectors and adiabatic couplers are micro-transfer printed onto the input and output of Si3N4 waveguides, providing efficient coupling without jeopardizing the rest of the PIC. Two-dimensional FDTD simulations predict coupling efficiencies as large as 70% (-1.5dB) at a wavelength of 785nm. As a proof-of-concept, we report an experimental coupling efficiency of -4.6dB, which is 2.6dB better than the values obtained with standard designs of grating couplers.
Transfer printing is an enabling technology for the efficient integration of III-V semiconductor devices on a silicon waveguide circuit. In this paper we discuss the transfer printing of substrate-illuminated III-V C-band photodetectors on a silicon photonic waveguide circuit. The devices were fabricated on an InP substrate, encapsulated and underetched in FeCl3, held in place by photoresist tethers. Using a 2x2 arrayed PDMS stamp with a pitch of 500 μm in x-direction and 250 μm in y-direction the photodiodes were transfer printed onto DVS-BCB-coated SOI waveguide circuits interfaced with grating couplers. 83 out of 84 devices were successfully integrated
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