Rapid advancement of materials and material-processing technologies has enabled fabrication of complex geometries on difficult-to-machine materials, and abrasive-finishing technology must in turn respond to those significant changes. An example of an advanced abrasive-finishing technique is the magnetic abrasive finishing (MAF) process. A magnetic abrasive comprises ferrous particles linked together along magnetic lines of force, when subjected to a magnetic field. These ferrous-particle chains offer configurational flexibility desired for the finishing process. Moreover, it is possible to influence the motion of a ferrous particle—even if the particle is not in direct contact with a magnet—by controlling the magnetic field. This impactful behavior of ferrous particles enables the application of the finishing operation not only to easily accessible surfaces but also to areas that are hard to reach by conventional mechanical techniques, such as freeform components and the interiors of flexible tubes. The obtained surface roughness ranges from the sub-nanometer to micrometer scales and alters light reflectivity, wettability by liquids, friction response, etc. Recent studies found that MAF leads to coloration of stainless-steel surfaces under certain finishing conditions through the formation of oxide layers. This presentation describes the fundamentals of MAF including some representative applications, the relationship between tool motion and the corresponding finished-surface structures, and characteristics of the observed coloration.
Effect of polishing contamination and surface defects for the LIDT has already been extensively studied in fused silica based transparent optics. The presence of contamination and damage layers on the surface of polished fused silica contributes to a large reduction in LIDT at ultraviolet wavelengths. The magnetic field-assisted finishing (MAF) technique has been shown to be successful in the fine finishing of optical components such as transparent Nd:YAG ceramics. Magnetic field-assisted finishing (MAF) with several tools has previously been applied to fused silica and was shown to improved surface LIDT at 266 nm.
In this paper, the damaged surface of fused silica with enhanced damage resistance after MAF was analyzed to classify the MAF processed condition. Irradiated energy density and damaged volume calculated from depth geometry were measured with a white color interference microscope (Zygo: Zegage). Fused silica substrates polished with CeO2 compounds were prepared as workpieces, and the surface roughness was about 0.3 nm Sq after optical polishing. Material removal over 100 nm occurred with the MAF process, however the final surface roughness did not change. The LIDT at a laser wavelength of 266 nm of processed surfaces was about 1.4 times higher than for the as-polished surface. The damaged volume of as-polished surface was linearly increased as increase in the irradiated energy density. In contrast, MAF processed surface showed little change for the damaged volume. The damage morphology will be also discussed.
Our development of ultra light-weight X-ray micro pore optics based on MEMS (Micro Electro Mechanical System)
technologies is described. Using dry etching or X-ray lithography and electroplating, curvilinear sidewalls
through a flat wafer are fabricated. Sidewalls vertical to the wafer surface are smoothed by use of high temperature
annealing and/or magnetic field assisted finishing to work as X-ray mirrors. The wafer is then deformed to
a spherical shape. When two spherical wafers with different radii of curvature are stacked, the combined system
will be an approximated Wolter type-I telescope. This method in principle allows high angular resolution and
ultra light-weight X-ray micro pore optics. In this paper, performance of a single-stage optic, coating of a heavy
metal on sidewalls with atomic layer deposition, and assembly of a Wolter type-I telescope are reported.
Microelectromechanical systems (MEMS) micropore X-ray optics were proposed as an ultralightweight, high-
resolution, and low cost X-ray focusing optic alternative to the large, heavy and expensive optic systems in
use today. The optic's monolithic design which includes high-aspect-ratio curvilinear micropores with minimal
sidewall roughness is challenging to fabricate. When made by either deep reactive ion etching or X-ray LIGA, the
micropore sidewalls (re
ecting surfaces) exhibit unacceptably high surface roughness. A magnetic eld-assisted
nishing (MAF) process was proposed to reduce the micropore sidewall roughness of MEMS micropore optics
and improvements in roughness have been reported. At this point, the best surface roughness achieved is 3
nm Rq on nickel optics and 0.2 nm Rq on silicon optics. These improvements bring MEMS micropore optics
closer to their realization as functional X-ray optics. This paper details the manufacturing and post-processing
of MEMS micropore X-ray optics including results of recent polishing experiments with MAF.
In recent years, X-ray telescopes have been shrinking in both size and weight to reduce cost and volume on
space flight missions. Current designs focus on the use of MEMS technologies to fabricate ultra-lightweight and
high-resolution X-ray optics. In 2006, Ezoe et al. introduced micro-pore X-ray optics fabricated using anisotropic
wet etching of silicon (110) wafers. These optics, though extremely lightweight (completed telescope weight 1
kg or less for an effective area of 1000 cm2), had limited angular resolution, as the reflecting surfaces were flat
crystal planes. To achieve higher angular resolution, curved reflecting surfaces should be used.
Both silicon dry etching and X-ray LIGA were used to create X-ray optics with curvilinear micro-pores;
however, the resulting surface roughness of the curved micro-pore sidewalls did not meet X-ray reflection criteria
of 10 nm rms in a 10 μm2 area. This indicated the need for a precision polishing process. This paper describes
the development of an ultra-precision polishing process employing an alternating magnetic field assisted finishing
process to polish the micro-pore side walls to a mirror finish (< 4 nmrms). The processing principle is presented,
and a polishing machine is designed and fabricated to explore the feasibility of this polishing process as a possible
method for processing MEMS X-ray optics to meet X-ray reflection specifications.
We have been developing ultra light-weight X-ray optics using MEMS (Micro Electro Mechanical Systems)
technologies.We utilized crystal planes after anisotropic wet etching of silicon (110) wafers as X-ray mirrors and
succeeded in X-ray reflection and imaging. Since we can etch tiny pores in thin wafers, this type of optics can
be the lightest X-ray telescope. However, because the crystal planes are alinged in certain directions, we must
approximate ideal optical surfaces with flat planes, which limits angular resolution of the optics on the order of
arcmin. In order to overcome this issue, we propose novel X-ray optics based on a combination of five recently
developed MEMS technologies, namely silicon dry etching, X-ray LIGA, silicon hydrogen anneal, magnetic fluid
assisted polishing and hot plastic deformation of silicon. In this paper, we describe this new method and report
on our development of X-ray mirrors fabricated by these technologies and X-ray reflection experiments of two
types of MEMS X-ray mirrors made of silicon and nickel. For the first time, X-ray reflections on these mirrors
were detected in the angular response measurements. Compared to model calculations, surface roughness of the
silicon and nickel mirrors were estimated to be 5 nm and 3 nm, respectively.
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