Dr. Jae Hong Park Profile

Dr. Jae Hong Park

Senior Researcher at National Nanofab Ctr

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 1 April 2016 Paper

Reversible nano-lithography for commercial approaches

Jae Hong Park, Hyun Ik Jang, Woo Choong Kim, Hae Yun, Jun Yong Park, Seok Woo Jeon, Hee Yeoun Kim, Chi Won Ahn

Proceedings Volume 9777, 977723 (2016) https://doi.org/10.1117/12.2205065

KEYWORDS: Nanostructures, Silicon, Polymers, Electron beam lithography, Lithography, Polymeric sensors, Polymeric actuators, Electro optic polymers, Solar energy, Process engineering, Nickel, Platinum, Nanolithography

Read Abstract +

Proceedings Article | 19 March 2015 Paper

Advanced nano lithography via soft materials-derived and reversible nano-patterning methodology for molding of infrared nano lenses

Jae Hong Park, Hyun Ik Jang, Jun Yong Park, Seok Woo Jeon, Woo Choong Kim, Hee Yeoun Kim, Chi Won Ahn

Proceedings Volume 9423, 94231N (2015) https://doi.org/10.1117/12.2080980

KEYWORDS: Silicon, Nanostructures, Nickel, Lithography, Platinum, Polymers, Nanolithography, Infrared lenses, Infrared radiation, Lenses

Read Abstract +

Proceedings Article | 19 June 2013 Paper

Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array size

Hee Yeoun Kim, Chungmo Yang, Jae Hong Park, Ho Jung, Taehyun Kim, Kyung Tae Kim, Sung Kyu Lim, Sang Woo Lee, Jay Mitchell, Wook Joong Hwang, Kwyro Lee

Proceedings Volume 8704, 87043E (2013) https://doi.org/10.1117/12.2015738

KEYWORDS: Semiconducting wafers, Microbolometers, Sensors, Resistance, Packaging, Reliability, Wafer bonding, Wafer testing, Wafer-level optics, Amorphous silicon

Read Abstract +

Proceedings Article | 31 May 2012 Paper

Study on optimizing the thickness of silicon window of WLP for IR sensor

Myeongho Song, Tae Hyun Kim, Moon Seop Hyun, Jae Hong Park, Hee Yeoun Kim, Gawon Lee

Proceedings Volume 8353, 83532B (2012) https://doi.org/10.1117/12.918982

KEYWORDS: Silicon, Transmittance, Semiconducting wafers, Infrared sensors, Sensors, Absorption, Oxygen, Packaging, Microelectromechanical systems, Germanium

Read Abstract +

Proceedings Article | 31 May 2012 Paper

Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure

Taehyun Kim, Kimyung Kyung, Jae Hong Park, Young Su Kim, Sung Kyu Lim, Kyungmin Kim, Kwyro Lee, C. Welham, Hee Yeoun Kim

Proceedings Volume 8353, 83531B (2012) https://doi.org/10.1117/12.918916

KEYWORDS: Microbolometers, Readout integrated circuits, Sensors, Thermography, Resistance, Capacitance, Semiconducting wafers, Materials processing, Amorphous silicon, Infrared imaging

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years