A novel packaging solution is discussed where both optical and electrical connectivity can be fabricated using ion-exchange (IOX) waveguides integrated into a glass with thin film metallization for an electrical redistribution layer. Design and process aspects are discussed to support silicon photonic flip-chip assembly directly to the glass substrate. Low-loss evanescent coupling occurs between the IOX waveguides embedded in the glass and the photonic chips with high-density silicon nitride optical I/Os. This design enables low-cost assembly methods involving the pick and place alignment of optical components and offers connectivity with low-profile mechanical transfer (MT) ferrule-based fiber connectors.
Single-mode, multi-fiber expanded-beam connectors (EBCs) were fabricated based on a two-step process using coreless glass fibers and two-photon polymerization (TTP) 3D printing technique. First, coreless glass fibers were spliced onto a single-mode fiber ribbon and then precisely laser-cleaved to the ideal length. A micro-lens array was directly laser printed onto the coreless fiber extensions using the TPP technique to create the expanded, collimated output beam. Coupling loss measurements at 1310 nm between two 3D-printed EBCs matched the results of simulations. The high spatial resolution of the TPP technique avoids cumbersome active alignment procedures, and thus enables low-cost, high-throughput optical connectivity solutions.
Co-packaged optical modules aim to meet the increasing bandwidth and power reduction requirements in next-generation datacenter switches. Meeting the cost per capacity targets requires new and innovative wafer-scale manufacturing solutions. In this work, glass with low-loss (<0.1 dB/cm) single-mode ion-exchanged waveguides is proposed as an optoelectronic substrate for co-packaged optics. High-speed ultrafast laser processes are developed to fabricate through glass vias for electrical connections, ablated features to enable passive alignment of MPO-connector to chip coupling, and for the singulation of glass wafers into individual optical circuits with optical quality end-facets for low-loss edge coupling without subsequent post-polishing or finishing steps.
We developed a small form factor connector that can be assembled on all four sides of a high-data switch package for fiber connectivity. This paper discusses a novel connector approach that has the potential to meet all co-packaging requirements including solder-reflow-compatibility, de-mateability, low insertion loss and state-of-the art FAU attach. The connector was attached to the PIC for performance evaluation. The average insertion loss across all eight fibers of the assembly was 1.77 dB, including the three optical interfaces: (1) MT-to-MT between connector and receptacle, (2) receptacle-to-PLC and (3) PIC-to-FAU. Also included is the propagation loss of the PIC waveguide. Optical return loss was measured to be -55 dB or lower.
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