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Dr. Jianzheng Hu
at Myongji Univ
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Publications (1)
Proceedings Article | 28 September 2006 Paper
Thermal effects of moisture inducing delamination in light-emitting diode packages
Jianzheng Hu, Lianqiao Yang, Moo Whan Shin
Proceedings Volume 6355, 635516 (2006) https://doi.org/10.1117/12.691555
KEYWORDS: Light emitting diodes, Lead, Resistance, Diffusion, Epoxies, Thermal effects, Finite element methods, Temperature metrology, Packaging, Interfaces
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