The Semiconductor Industry is making continuous progress in shrinking feature size developing technologies and process to achieve < 10 nm feature size. The required Overlay specification for successful production is in the range one nanometer or even smaller. Consequently, materials designed into metrology systems of exposure or inspection tools need to fulfill ever tighter specification on the coefficient of thermal expansion (CTE). The glass ceramic ZERODUR® is a well-established material in critical components of microlithography wafer stepper and offered with an extremely low coefficient of thermal expansion, the tightest tolerance available on market. SCHOTT is continuously improving manufacturing processes and it’s method to measure and characterize the CTE behavior of ZERODUR®. This paper is focusing on the "Advanced Dilatometer" for determination of the CTE developed at SCHOTT in the recent years and introduced into production in Q1 2015. The achievement for improving the absolute CTE measurement accuracy and the reproducibility are described in detail. Those achievements are compared to the CTE measurement accuracy reported by the Physikalische Technische Bundesanstalt (PTB), the National Metrology Institute of Germany. The CTE homogeneity is of highest importance to achieve nanometer precision on larger scales. Additionally, the paper presents data on the short scale CTE homogeneity and its improvement in the last two years. The data presented in this paper will explain the capability of ZERODUR® to enable the extreme precision required for future generation of lithography equipment and processes.
The IC Lithography roadmap foresees manufacturing of devices with critical dimension of < 20 nm. Overlay
specification of single digit nanometer asking for nanometer positioning accuracy requiring sub nanometer
position measurement accuracy. The glass ceramic ZERODUR® is a well-established material in critical
components of microlithography wafer stepper and offered with an extremely low coefficient of thermal
expansion (CTE), the tightest tolerance available on market. SCHOTT is continuously improving manufacturing
processes and it’s method to measure and characterize the CTE behavior of ZERODUR® to full fill the ever
tighter CTE specification for wafer stepper components. In this paper we present the ZERODUR® Lithography
Roadmap on the CTE metrology and tolerance. Additionally, simulation calculations based on a physical model
are presented predicting the long term CTE behavior of ZERODUR® components to optimize dimensional
stability of precision positioning devices. CTE data of several low thermal expansion materials are compared
regarding their temperature dependence between - 50°C and + 100°C. ZERODUR® TAILORED 22°C is full
filling the tight CTE tolerance of +/- 10 ppb / K within the broadest temperature interval compared to all other
materials of this investigation. The data presented in this paper explicitly demonstrates the capability of
ZERODUR® to enable the nanometer precision required for future generation of lithography equipment and
processes.
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