In this study, a mask suitable for three materials evaporated from one single e-beam source is developed to obtain uniform thickness distribution. The design method is based on film thickness theory and the assumption that a substrate holder rotates about its central axis during the deposition of films. The uniform thickness distributions of the SiO2, TiO2 and Ag films deposited with the designed mask are achieved in an e-beam evaporation chamber. The design of a mask in thickness uniformity for three coating materials cuts the development time and requires less trial and error than traditionally experimental correction loops.
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