Prof. Lianwei Wang Profile

Prof. Lianwei Wang

Research Fellow at East China Normal Univ

SPIE Involvement:

Author

Proceedings Article | 16 December 2013 Paper

Characterization of SnO2/Ni/SiO2-MCP anode in three-dimensional lithium-ion battery

Xuefeng Lou, Shaohui Xu, Yiping Zhu, Lianwei Wang, Paul Chu

Proceedings Volume 9068, 90681Q (2013) https://doi.org/10.1117/12.2053841

KEYWORDS: Electrodes, Microchannel plates, Lithium, Tin, Silicon, Nickel, Scanning electron microscopy, Thin films, Neodymium, Oxidation

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Proceedings Article | 16 December 2013 Paper

Super capacitance properties of SnO2 coated nickel/silicon microchannel plates

Keshuang Hui, Yiping Zhu, Shaohui Xu, Lianwei Wang, Paul Chu

Proceedings Volume 9068, 90681P (2013) https://doi.org/10.1117/12.2053840

KEYWORDS: Capacitance, Electrodes, Oxides, Scanning electron microscopy, Tin, Microchannel plates, Resistance, Nickel, Dielectric spectroscopy, Silicon

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SPIE Journal Paper | 1 July 2009

Large-size P-type silicon microchannel plates prepared by photoelectrochemical etching

Ding Yuan, Pengliang Ci, Fei Tian, Jing Shi, Shaohui Xu, Peisheng Xin, Lianwei Wang, Paul Chu

JM3, Vol. 8, Issue 03, 033012, (July 2009) https://doi.org/10.1117/12.10.1117/1.3158616

KEYWORDS: Etching, Microchannel plates, Silicon, Lamps, Semiconducting wafers, Scanning electron microscopy, Halogens, High aspect ratio silicon micromachining, Electrochemical etching, Scattering

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Proceedings Article | 11 March 2008 Paper

Fabrication and characterization of 3D pn junction structure for radiation detection

Tingting Liu, Tao Liu, Jinlong Li, Jilei Lin, Xiaoming Chen, Xinglong Guo, Peisheng Xin, Shaohui Xu, Weijia Xue, Lianwei Wang

Proceedings Volume 6984, 69843M (2008) https://doi.org/10.1117/12.792237

KEYWORDS: Silicon, Sensors, 3D metrology, Diffusion, Phosphorus, Computer simulations, Semiconductors, Energy conversion efficiency, Device simulation, Lithography

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Proceedings Article | 11 March 2008 Paper

Investigation of nanostructure on silicon by electrochemical etching

Liang Xu, Jinchuan You, Lianwei Wang

Proceedings Volume 6984, 69842Z (2008) https://doi.org/10.1117/12.792382

KEYWORDS: Silicon, Nanostructures, Electrochemical etching, Semiconducting wafers, Etching, Computing systems, Scanning electron microscopy, Nanolithography, Bioalcohols, Dry etching

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Proceedings Article | 11 March 2008 Paper

A beam operated MEMS variable optical attenuator

Shuqin Ding, Xiaodong Zhang, Xiaoming Chen, Lianwei Wang

Proceedings Volume 6984, 69843N (2008) https://doi.org/10.1117/12.792241

KEYWORDS: Mirrors, Signal attenuation, Microelectromechanical systems, Variable optical attenuators, Fiber optics, Silicon, Collimators, Semiconducting wafers, Photomasks, Electromechanical design

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Proceedings Article | 8 December 2004 Paper

Influence of experimental environment on the process of photo-assisted electrochemical etching process on silicon

Yu Chen, Pingsheng Guo, Lianwei Wang

Proceedings Volume 5774, (2004) https://doi.org/10.1117/12.607809

KEYWORDS: Etching, Silicon, Electrochemical etching, Semiconducting wafers, Temperature metrology, Physics, Deep reactive ion etching, Lamps, Microelectromechanical systems, Diffusion

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Proceedings Article | 8 December 2004 Paper

Index-compatible design of multilayer film for MEMS-type variable optical attenuator

Deyan Peng, Guodong Li, Lianwei Wang, Zongshen Lai

Proceedings Volume 5774, (2004) https://doi.org/10.1117/12.607904

KEYWORDS: Fabry–Perot interferometers, Silicon films, Reflection, Silicon, Variable optical attenuators, Thin films, Optical design, Refractive index, Optical alignment, Structural design

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Proceedings Article | 8 December 2004 Paper

Transfer bonding of thick silicon nitride film via split of porous silicon

X. Bao, Yan Ding, Yu Chen, Ping Guo, Yan Shi, Lian Wang, Zong Lai

Proceedings Volume 5774, (2004) https://doi.org/10.1117/12.607898

KEYWORDS: Silicon, Silicon films, Glasses, Epoxies, Plasma enhanced chemical vapor deposition, Signal attenuation, Thin films, Crystals, Wafer bonding, Infrared radiation

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Proceedings Article | 15 January 2003 Paper

Wafer thinning for high-density through-wafer interconnects

Lianwei Wang, Cassan Visser, Charles de Boer, M. Laros, W. van der Vlist, J. Groeneweg, G. Craciun, Pasqualina Sarro

Proceedings Volume 4979, (2003) https://doi.org/10.1117/12.473374

KEYWORDS: Semiconducting wafers, Particles, Etching, Silicon, Polishing, Abrasives, Chemical mechanical planarization, Wet etching, Photomasks, Oxides

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Showing 5 of 10 publications

SPIE Conference Volume | 8 December 2004

Fifth International Conference on Thin Film Physics and Applications

Conference Committee Involvement (1)

Fifth International Conference on Thin Film Physics and Applications

31 May 2004 | Shanghai, China

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