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Lutz Hofmann
Research Staff for 3D-TSV Integration of MEMS at Fraunhofer-Institut für Elektronische Nanosysteme
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Publications (2)
Proceedings Article | 21 May 2015 Paper
3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding
L. Hofmann, S. Dempwolf, D. Reuter, R. Ecke, K. Gottfried, S. Schulz, R. Knechtel, T. Geßner
Proceedings Volume 9517, 951709 (2015) https://doi.org/10.1117/12.2178598
KEYWORDS: Semiconducting wafers, Microelectromechanical systems, Wafer bonding, Glasses, Copper, Etching, CMOS technology, Sensors, Metals, Silicon
Proceedings Article | 1 March 2006 Paper
4-ary PAM signaling for increasing the capacity of metro light-wave systems
Proceedings Volume 6105, 610509 (2006) https://doi.org/10.1117/12.648469
KEYWORDS: Receivers, Modulation, Modulators, Dense wavelength division multiplexing, Interference (communication), Eye, Binary data, Numerical simulations, Time division multiplexing, Dispersion
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