Prof. Mary Ann J. Hockey Profile

Prof. Mary Ann J. Hockey

Applications Engineering Manager at Brewer Science Inc

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Author

Publications (9)

Proceedings Article | 3 June 2019 Presentation + Paper

An alternative line-space shrink EUVL plus complementary DSA lithography

Mary Ann Hockey

Proceedings Volume 10958, 1095812 (2019) https://doi.org/10.1117/12.2518122

KEYWORDS: Etching, Extreme ultraviolet lithography, System on a chip, Line width roughness, Lithography, Extreme ultraviolet, Optical lithography, Scanning electron microscopy, Double patterning technology, Dry etching

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Proceedings Article | 20 March 2018 Paper

Optimized plasma etch window of block copolymers and neutral brush layers for enhanced direct self-assembly pattern transfer into a hardmask layer

Nickolas Brakensiek, Kui Xu, Daniel Sweat, Mary Ann Hockey

Proceedings Volume 10589, 105890S (2018) https://doi.org/10.1117/12.2297456

KEYWORDS: Etching, Carbon monoxide, Chemistry, Plasma etching, Oxygen, Plasma, Directed self assembly, Nitrogen

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Proceedings Article | 19 March 2018 Presentation

Manufacturing directed self assembly flows enabled by advanced materials (Conference Presentation)

Mary Ann Hockey

Proceedings Volume 10584, 105840O (2018) https://doi.org/10.1117/12.2304949

KEYWORDS: Directed self assembly, Manufacturing, Etching, Annealing, Lithography, Chemistry, Temperature metrology, Wet etching, Dry etching, Photomasks

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Material challenges for DSA Directed Self-Assembly (DSA) of block copolymers are accompanied by processing automation and throughput complexity for successful implementation into manufacturing. Our goal was to address the ability of this complementary lithography technique to offer streamlining with respect to thermal anneal time, lowering it from hours to minutes. In addition, the standard high temperature anneal at 250-270˚C was decreased to 160-180˚C with low levels of defects measured. This DSA requirement designed to shift to low temperatures for thermal annealing is primarily due to low Tg monomers incorporated into the copolymer blocks. Chemoepitaxy DSA processes can be simplified significantly with more potential as a result of lower Tg. 193i nm lithography continues to be utilized for creating guiding patterns that provide the ability to achieve pattern density multiplication and defect rectification. In parallel, we are providing additional chemistry enhancement techniques for feature sizes <10 nm by improving wet etch pattern transfer capability specifically targeted to mitigate pattern collapse. Dry etch process steps for removal of one block, followed by pattern transfer into hard mask layers are enhanced with the incorporation of monomers into the PS block of the high chi BCP with the intent to minimize issues due to low selectivity values. Etch selectivity has been increased from 3:1 to 6:1 with customizing the copolymer blocks. Due to the fact that the practical application of high chi DSA continues to face technical and material challenges in comparison to standard PS-b-PMMA process steps, BSI achieved low temperature and short time block copolymer annealing with the innovation of material enhancement chemistry. Specially designed materials have been developed to improve material robustness for pattern fidelity after etching multi-stack spin on layers for DSA requirements. We have enabled the extension of the functionality and capability of our block copolymer (BCP) materials in order to easily transfer a DSA flow into manufacturing in addition to no need for top-coat or solvent annealing to get perpendicular orientation as we reported before1.

Proceedings Article | 13 March 2018 Presentation + Paper

Straightforward directed self-assembly process flows enabled by advanced materials

Kui Xu, Eric Calderas, Mary Ann Hockey, Douglas Guerrero, Richard Daugherty, Yichen Liang

Proceedings Volume 10586, 105860W (2018) https://doi.org/10.1117/12.2297013

KEYWORDS: Directed self assembly, Annealing, Polymers

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Proceedings Article | 27 March 2017 Presentation + Paper

High-χ block copolymers for directed self-assembly patterning without the need for topcoat or solvent annealing

Kui Xu, Mary Ann Hockey, Eric Calderas, Douglas Guerrero, Daniel Sweat, Jeffrey Fiehler, Richard Daugherty

Proceedings Volume 10146, 101460U (2017) https://doi.org/10.1117/12.2257354

KEYWORDS: Directed self assembly, Annealing, Polymers, Scanning electron microscopy, Wet etching, Glasses

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Proceedings Article | 28 March 2014 Paper

Streamlined etch integration with a unique neutral layer for self-assembled block copolymers (BCPs)

Mary Ann Hockey, Kui Xu, Yubao Wang, Douglas Guerrero, Eric Calderas

Proceedings Volume 9049, 90492A (2014) https://doi.org/10.1117/12.2046351

KEYWORDS: Etching, Annealing, Resistance, Scanning electron microscopy, Polymethylmethacrylate, Plasma etching, Photoresist materials, System on a chip, Picosecond phenomena, Directed self assembly

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Proceedings Article | 26 March 2013 Paper

Multifunctional hardmask neutral layer for directed self-assembly (DSA) patterning

Douglas Guerrero, Mary Ann Hockey, Yubao Wang, Eric Calderas

Proceedings Volume 8680, 86801P (2013) https://doi.org/10.1117/12.2011567

KEYWORDS: Etching, Optical lithography, System on a chip, Lithography, Reflection, Critical dimension metrology, Photoresist materials, Polymethylmethacrylate, Polonium, Directed self assembly

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Proceedings Article | 15 October 2012 Paper

The effectiveness of metal oxide nanocrystal-enhanced polymers as hardmasks for photolithography

Mary Ann Hockey, Qin Lin, Eric Calderas

Proceedings Volume 8456, 84560Q (2012) https://doi.org/10.1117/12.928964

KEYWORDS: Etching, Nanoparticles, Polymers, Nanocomposites, Metals, Oxides, Silicon, Nanocrystals, Photoresist materials, Zirconium dioxide

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Proceedings Article | 17 March 2012 Paper

How much further can lithography process windows be improved?

Mary Ann Hockey, Qin Lin, Eric Calderas

Proceedings Volume 8328, 83280Q (2012) https://doi.org/10.1117/12.915672

KEYWORDS: Etching, Nanocrystals, Polymers, Photoresist materials, Line width roughness, Lithography, Silicon, System on a chip, Sol-gels, Nanocomposites

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Showing 5 of 9 publications

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