KEYWORDS: Solar cells, Dye sensitized solar cells, Silicon, Resistance, Semiconductors, Light emitting diodes, Diodes, Temperature metrology, Power supplies
Solar energy conversion is today a very hot topic in order to reduce the global warming and pollution. The solar cells based on Silicon, either monocrystalline or amorphous are already on the market since many years. We will present in the paper some performance studies on a promising different type of solar cell called Dye-sensitized solar cell (DSSC), or Grätzel cells [1], [2]. This cell presents different construction and operation principles from silicon based cells and represents a possible solution to replace them for large area or flexible panels. Being a relatively new photovoltaic solution, it is of interest to study the effect of working temperature on their voltage-current characteristic. We will present in current paper electrical measurements on DSSC prototype samples, compared with a commercial silicon cell, for different illumination levels and different temperatures. In order to summarize the results, voltage-current characteristics and the main parameters of the cells, as short circuit current, open circuit voltages, maximum power point (MPP) will be comparatively presented in the paper.
In this paper we present an experimental set-up for measuring small frequency differences between two RF oscillators [1] by using a homodyne detection scheme [2]. To emulate the oscillators, we used two RF sources whose output signals were mixed and then the low frequency components at the mixer's output was measured with a network frequency analyzer. The purpose of these experiments was to evaluate a possible method to discriminate the resonance frequency change of a TF-BAR sensor as a response to its contamination with certain substances.
These days we experience the in-going of Solid state lighting (SSL) in many domestic and industrial domains. Interconnection of LEDs on flexible substrates is one of the important directions of interest for different applications as backlights for flexible displays and flexible lighting sources or wearable devices [1,2,3].
This paper presents the results of investigations related to interconnection of mid power LEDs on flexible substrates. Soldering of LED packages involves a thermal stress during soldering which has a possible negative impact on led string reliability, more present if lead-free soldering is used. By using a printed conductive paste for device attachment, the thermal stress is considerably reduced. Adhesive bonding as an alternative to soldering can be applied to low cost substrates as polyethylene terephthalate (PET). We present, based on infrared camera measurements the limits of power levels that can be applied for different flexible circuits, taking as reference LED structures on polyimide (PI) substrate and on glass epoxy (FR4). The thermal considerable thermal dissipation of the LEDs during operation and the specific attachment to foil with lower thermal conductivity will rise problems on the thermal design.
These days many variants for lighting systems are available on the market, and new solutions are about to emerge. Most of the new lamps are offered in form to be retrofitted to existing sockets and luminaires. In this paper, are presented some systematically investigations on different lamps as LEDs, Compact Fluorescent Lamps (CFLs), tungsten, and new available Cold Cathode Fluorescent Lamps (CCFLs), regarding the light level, dimming performances and also the resulting flicker and power distortion performances. The light level was expressed by the illuminance level, measured for all lamps in the same conditions, at the same distance and on the same surface represented by the photometer probe.
The paper aims to describe the fabrication of organic transistors and their integration into hybrid circuits on flexible
substrates. Organic thin film transistors (OTFT) are fabricated using commercially available materials. The Au S-D
electrodes are realized by photolithography, while the organic semiconductor and organic dielectric layers are spincoated. Finally, the Au gate electrode is evaporated in order to obtain a Bottom Contact Top Gate OTFT architecture. The paper presents a prototype realized in classic technology on rigid substrate, which is used to perform a PSpice simulation of the circuit. After the PSpice simulation, a module on PET substrate is made with organic transistors. Two transistors are employed to build the inverter used to switch the LED, while a third transistor is diode connected and acts as a 10MOhms resistor. The electrical characterization of the transistors and measurements onto the module are performed with a 4200 Keithley Semiconductor Analyzer. An SMD LED, in 0402 package, is used and all
interconnections are done manually using Silver conductive paste, which dries at room temperature. The paper describes the circuit simulation and layout realization.
Organic Electronics (OE), named also FOLAE (Flexible, Organic, (Printed) and Large Area Electronics), is a new branch of electronics, dealing with polymers and plastics, in contrast with traditional electronics, which is based on silicon, copper, oxides, etc. OE acts as a catalyst for the cost effectiveness on the market, being an emerging and fast growing field with high potential in industry. Some OE products (as OLED displays) are already on the market and others (as solar cells, lighting, transistors, etc.) are ready for it, being in the small volume manufacturing stage. Europe has a leading position in OE, mainly due to R and D collaboration, and various European projects try to strengthen this position. On these terms, the paper wants to offer an overview in teaching OE for development of future electronic systems, being destined not only to academia, but also to SMEs, professional associations, and research institutes for exploiting the synergies and complementarities of traditional electronics and OE [6].].
The present and near future lighting solutions will include surely power light-emitting diodes (LEDs). With increasingly
power offered by the modern structures, thermal management issues can arise. In this paper we present thermal investigations on three type of power LED, of 1W, 3W and a 10W module. The investigations are oriented in direction of offering trusty suggestions and solutions regarding the thermal regime of discrete LED used as stand-alone or in assembly modules. The temperature will be determined through thermal simulation. The simulation based on finite-element models will bring valuable results, especially for multiple LED modules for which the model with thermal resistance offer only global results, without information of PCB temperature. For the measurements preparation the LEDs are attached to printed circuit boards (PCBs): classic FR4 and metal core PCB (MCPCB). The measurements will be done by combining thermocouples data acquisition system with IR thermovision camera.
The paper presents the results obtained by the authors in the field of the system cosimulation
of optoelectronic sensors. The aim was to make investigations in the multidomain
simulation of the optoelectronic components and devices using PSpice and
MATLAB/Simulink environments. The conclusion of this study is that a co-simulation
environment allows to simulate the whole system using accurate models for the
electronic devices.
High Density Interconnect (HDI) technology is a way to condense electronic circuits for ruggedness, radiation
hardening, and high performance. HDI minimizes the size and weight of electronic products while maximizing their
performances. HDI circuits offer new solutions to signal integrity (SI) and electromagnetic compatibility (EMC)
concerns, concerns which are expected to grow more and more as rise/fall times continue to drop. Because PCB
manufacturers have developed new materials and technological solutions, indispensable at this moment is to perform a
deep virtual characterization of structures directly related to HDI. This paper presents investigations and results focused
on the main areas of SI and EMC, as noise at PCB level (reflections, and crosstalk), electromagnetic interference (EMI)
and on-board interconnection delay. The authors have evaluated various HDI-PCB items and structures using the MoM
full-wave electromagnetic simulation method. After modeling and simulation a link to classical circuit simulators was
created by extracting RLCG elements and various parameters, which are directly related to the total current along the
HDI structures. The paper offers a new way to find the solutions for keeping the integrity of signals and electromagnetic
compliance.
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