Photon counting imaging applications requires low noise from both detector and readout integrated circuit (ROIC) arrays. In order to retain the photon-counting-level sensitivity, a long integration time has to be employed and the dark current has to be minimized. It is well known that the PIN dark current is sensitive to temperature and a dark current density of 0.5 nA/cm2 was demonstrated at 7 °C previously. In order to restrain the size, weight, and power consumption (SWaP) of cameras for persistent large-area surveillance on small platforms, it is critical to develop large format PIN arrays with small pitch and low dark current density at higher operation temperatures. Recently Spectrolab has grown, fabricated and tested 1024x1280 InGaAs PIN arrays with 12.5 μm pitch and achieved 0.7 nA/cm2 dark current density at 15 °C. Based on our previous low-dark-current PIN designs, the improvements were focused on 1) the epitaxial material design and growth control; and 2) PIN device structure to minimize the perimeter leakage current and junction diffusion current. We will present characterization data and analyses that illustrate the contribution of various dark current mechanisms.
Daniel Law, J. Boisvert, E. Rehder, P. Chiu, S. Mesropian, R. Woo, X. Liu, W. Hong, C. Fetzer, S. Singer, D. Bhusari, K. Edmondson, A. Zakaria, B. Jun, D. Krut, R. King, S. Sharma, N. Karam
Recent progress in III-V multijunction space solar cell has led to Spectrolab’s GaInP/GaAs/Ge triple-junction, XTJ, cells with average 1-sun efficiency of 29% (AM0, 28°C) for cell size ranging from 59 to 72-cm2. High-efficiency inverted metamorphic (IMM) multijunction cells are developed as the next space solar cell architecture. Spectrolab’s large-area IMM3J and IMM4J cells have achieved 33% and 34% 1-sun, AM0 efficiencies, respectively. The IMM3J and the IMM4J cells have both demonstrated normalized power retention of 0.86 at 5x1014 e-/cm2 fluence and 0.83 and 0.82 at 1x1015 e-/cm2 fluence post 1-MeV electron radiation, respectively. The IMM cells were further assembled into coverglass-interconnect-cell (CIC) strings and affixed to typical rigid aluminum honeycomb panels for thermal cycling characterization. Preliminary temperature cycling data of two coupons populated with IMM cell strings showed no performance degradation. Spectrolab has also developed semiconductor bonded technology (SBT) where highperformance component subcells were grown on GaAs and InP substrates separately then bonded directly to form the final multijunction cells. Large-area SBT 5-junction cells have achieved a 35.1% efficiency under 1-sun, AM0 condition.
The photovoltaic characterization of triple-junction InGaP2/GaAs/Ge solar cells is presented. Measurements made using a single light source solar simulator are compared with other measurements made using a multi-light source solar simulator that provides a close match to the air mass zero (AM0) solar spectrum. The output spectrum of the solar simulators has been measured, and two methods for calibrating the simulator output intensity haven been employed. The spectral response of the solar cells has been characterized through quantum efficiency measurements. These data are analyzed to determine the effect of the simulator spectrum on the measured photovoltaic response, and in particular, areas where spectral mismatch between the simulator and AM0 can lead to inaccurate performance predictions are highlighted. In addition, the effects of the different calibration techniques on the measured data are studied. Exploiting the capabilities of the multi-source, close matched simulator, the response of each of the three sub-junctions are studied individually, and the interplay between the spectral response of the sub-junctions and the incident spectrum is investigated.
Low cost germanium photodetectors for sensing applications in the 900-1600 nm spectral region have been developed. By varying the Ge substrate resistivity as well as device area, photodetector properties such as reverse leakage current, capacitance, and shunt resistance have been engineered. Low leakage current devices of various sizes up to 1 cm2 have been fabricated and have consistently exhibited exceptionally high shunt resistances and excellent linearity. Over 5000 hours of active stress testing have left the ultra-low leakage currents unchanged. These data were measured in accordance with Telcordia 468-CORE requirements at 85°C, 125°C and 175°C. The results indicate that these mesa photodetectors meet telecommunication industry requirements for reliability. These devices are comparable to commercially available Ge photodetectors, and can be readily substituted for more complex InGaAs photo-detectors in applications such as laser monitor diodes.
Germanium (Ge) photodetectors are fabricated by growing epitaxial III-V compounds on Ge substrates and by in-situ formation of the PN junction by MOVPE. After material growth, Ge photodetectors are mesa-etched using conventional optoelectronic device processing techniques. By varying the Ge substrate resistivity and the device area, Ge photodetector properties such as reverse leakage current, capacitance, and shunt resistance have been engineered. Such devices have demonstrated leakage currents below 50(mu) A/cm2 at -0.1 V bias. For optoelectronic applications that require high temperature operation, high shunt resistance detectors exhibit leakage currents below (mu) A/cm2 at 80 degree(s)C. Low capacitance devices have measured as little as 275 pF at 0V bias for a 1 mm diameter detector. High shunt resistance devices are a low cost alternative to conventional InGaAs photodiodes in applications such as laser monitor diodes.
This paper reports the deposition of (100) GaAs and (111)B CdZnTe layers on silicon substrates up to 4-inch diameter to produce substrates suitable for liquid phase epitaxy (LPE) of high-quality HgCdTe layers. Metalorganic chemical vapor deposition is used for both GaAs and CdZnTe in a reactor capable of deposition onto eighteen 3-inch or ten 4-inch wafers per run. An encapsulation scheme is described that prevents contamination of a Te melt by Si or GaAs during LPE growth. Excellent uniformity of thickness and Zn concentration are achieved in the MOCVD films. The CdZnTe films show only lamellar twins close to the GaAs interface; no twins capable of propagating into the HgCdTe layer are formed. These substrates have been used for the growth of pure HgCdTe films having a dislocation density that is only a factor of 2 to 4 higher than that measured in similar films grown on bulk CdTe substrates.
Results are presented on uniform deposition of CdTe, HgTe, and HgCdTe thin films by atomic layer epitaxy (ALE) using Hg-, Cd-, and Te-alkyl chemistry at deposition rates of a few monolayers/min. In contrast, we also discuss the deposition of uniform CdTe(Zn) films on large-area alternative substrates by conventional metalorganic chemical vapor deposition (MOCVD) at growth rates of a few monolayers/sec. Excellent thickness and compositional uniformity (1% standard deviation) have been achieved for MOCVD CdTe(Zn) films on 75 mm GaAs and Si substrates. ALE growth of CdTe was carried out over a wide range of temperatures (250 to 320 degree(s)C) and reactant partial pressures. ALE of HgTe with excellent uniformity and surface morphology has been achieved over the temperature range of 120 to 160 degree(s)C. HgCdTe layers were also grown by alternately depositing HgTe and CdTe on CdTe substrates and then interdiffusing them at higher temperatures. FTIR measurements of a 0.43 micron thick HgCdTe film deposited by this technique showed excellent characteristics.
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