In an earlier paper we have described a concept for high speed 3D inspection using fringe projection techniques. We use
a special CMOS camera with 300 x 300 px which can calculate the phase on board. The focus of the first step of
development had been a fringe projector, which was able to modulate the projected fringes with up to 250 kHz.
In the second step the image acquisition part of the system was developed. In case of 3D measurement with a matrix
camera, the camera resp. the measuring object has to be moved stepwise in the lateral direction to cover multiple
acquisition areas of the measurement object. Between each image the lateral movement has to correspond to the field of
view of the camera. At the intended very high image acquisition rates the high acceleration of the system between each
image will lead to inacceptable mechanical forces.
In order to obtain a continuous scanning procedure and at the same time to use the performance of a matrix camera, a
special lens system was developed. A measurement field 120 mm long and 3 mm wide is imaged onto the camera. The
width of the measuring field is imaged onto the 300 rows of the camera, giving a lateral resolution of 10 μm. In the longitudinal direction the 120 mm object length is divided into 12’000 lines to reach the same resolution of 10 μm. Due
to technical reasons that will be described later only 240 of the 300 pixel rows on the chip were used. Consequently, with each camera shot 240 separated lines are imaged onto the chip. Between each of these 240 lines there is a large empty space, which is not imaged by the camera. In principle, the camera is operating as 240 single line cameras. Therefore, if the camera is shifted in an inclined direction to the camera orientation over the object, the empty spaces can be recorded as well. In an optimum alignment, the complete measuring object can be scanned in a continuous movement, covering the total length of 120 mm. In this paper we will describe this image acquisition system and give first measuring results.
KEYWORDS: Cameras, Optical interferometry, Inspection, Mirrors, Interferometry, Demodulation, Interferometers, Scanners, Data acquisition, Near field optics
White-light interferometry is a highly accurate technology for 3D measurements. The principle is widely utilized in
surface metrology instruments but rarely adopted for in-line inspection systems. The main challenges for rolling out
inspection systems based on white-light interferometry to the production floor are its sensitivity to environmental
vibrations and relatively long measurement times: a large quantity of data needs to be acquired and processed in order to obtain a single topographic measurement.
Heliotis developed a smart-pixel CMOS camera (lock-in camera) which is specially suited for white-light
interferometry. The demodulation of the interference signal is treated at the level of the pixel which typically reduces the
acquisition data by one orders of magnitude. Along with the high bandwidth of the dedicated lock-in camera, vertical
scan-speeds of more than 40mm/s are reachable. The high scan speed allows for the realization of inspection systems
that are rugged against external vibrations as present on the production floor.
For many industrial applications such as the inspection of wafer-bumps, surface of mechanical parts and solar-panel,
large areas need to be measured. In this case either the instrument or the sample are displaced laterally and several
measurements are stitched together. The cycle time of such a system is mostly limited by the stepping time for multiple
lateral displacements.
A line-scanner based on white light interferometry would eliminate most of the stepping time while maintaining
robustness and accuracy. A. Olszak proposed a simple geometry to realize such a lateral scanning interferometer. We
demonstrate that such inclined interferometers can benefit significantly from the fast in-pixel demodulation capabilities
of the lock-in camera. One drawback of an inclined observation perspective is that its application is limited to objects
with scattering surfaces. We therefore propose an alternate geometry where the incident light is normal to the object
surface and where an inclined grating is used as reference mirror.
The paper presents the novel approach to an interferometric, quantitative, massive parallel inspection of
MicroElectroMechanicalSystems (MEMS), MicroOptoElectroMechanical Systems (MOEMS) and
microoptics arrays. The basic idea is to adapt a micro-optical probing wafer to the M(O)EMS wafer under
test. The probing wafer is exchangeable and contains one of the micro-optical interferometer arrays based on:
(1) a low coherent interferometer array based on a Mirau configuration or (2) a laser interferometer array
based on a Twyman-Green configuration. The optical, mechanical, and electro-optical design of the system
and data analysis concept based on this approach is presented. The interferometer arrays are developed and
integrated at a standard test station for micro-fabrication together with the illumination and imaging modules
and special mechanics which includes scanning and electrostatic excitation systems. The smart-pixel approach
is applied for massive parallel electro-optical detection and data reduction. The first results of functional tests
of the system are presented. The concept is discussed in reference to the future M(O)EMS and microoptics
manufacturers needs and requirements.
Fringe projection techniques have been widely used for inspection of free form surfaces for quality inspection or reverse
engineering purposes. For inline 3D-inspection systems maximum measuring speed is of vital interest. Typically, image
acquisition and processing rates of up to 10'000 frames/s are state of the art.
In order to exceed this value, we propose a fringe projection concept which uses a high speed CMOS camera with in
pixel phase calculation. The camera can record up to 1 million frames/s. An analogue calculation is realized in every
pixel to extract the phase of the temporarily modulated light.
In order to determine a phase, the illumination light must be modulated with a quarter of the frame rate of the image
acquisition device, in our case with up to 250 kHz. In fringe projection techniques, the projected fringes must be shifted
with respect to the inspected surface. Mechanical phase shifting of the fringes becomes the crucial problem in ultra high
speed fringe projection. We have investigated a new way to generate 250 kHz phase shifted fringes. In this paper, we
present the new fringe projection technique and discuss the results of our high speed 3D measuring device.
Industry rely a lot on vision for in line or off line quality inspection. Whereas most of these applications use 2D vision,
the need for 3D vision is increasing. Optical Coherence Tomography (OCT) is widely used in medical application to
obtain 3D images of biological tissues but is still limited to low-speed and high price instruments in industrial
applications.
We developed a CMOS camera specially designed for parallel OCT (p-OCT). The advantage of this method over other
OCT techniques is its high speed and its ability to maintain a high lateral resolution over large measurement depths. Our
camera can acquire up to one million 2D images per second. The amplitude and phase of the modulated signal is
calculated within every pixel. Up to 10'000 such amplitude and phase results can be returned in a second, for every pixel.
We will present our instrument, which includes a rugged and compact interferometer aligned with a robotized assembly
technique. This imaging interferometer is scanned during acquisition, allowing to maintain a high lateral resolution
(typically 2 micron) over several millimeters. The interferometer is easily interchangeable (snap-in magnets) in order to
choose the ideal magnification for the application. This compact and versatile system can be built directly on a robot arm
or scanned over large objects.
KEYWORDS: Cameras, Demodulation, Interferometers, Interferometry, Imaging systems, Inspection, Signal detection, Signal processing, Data processing, Modulation
The paper presents the electro-optical design of an interferometric inspection system for massive parallel inspection of
Micro(Opto)ElectroMechanicalSystems (M(O)EMS). The basic idea is to adapt a micro-optical probing wafer to the
M(O)EMS wafer under test. The probing wafer is exchangeable and contains a micro-optical interferometer array: a low
coherent interferometer (LCI) array based on a Mirau configuration and a laser interferometer (LI) array based on a
Twyman-Green configuration. The interference signals are generated in the micro-optical interferometers and are applied
for M(O)EMS shape and deformation measurements by means of LCI and for M(O)EMS vibration analysis (the
resonance frequency and spatial mode distribution) by means of LI. Distributed array of 5×5 smart pixel imagers detects
the interferometric signals. The signal processing is based on the "on pixel" processing capacity of the smart pixel
camera array, which can be utilised for phase shifting, signal demodulation or envelope maximum determination. Each
micro-interferometer image is detected by the 140 × 146 pixels sub-array distributed in the imaging plane. In the paper
the architecture of cameras with smart-pixel approach are described and their application for massive parallel electrooptical
detection and data reduction is discussed. The full data processing paths for laser interferometer and low coherent
interferometer are presented.
The paper introduces different approaches to overcome the large ratio between wafer size and feature size in the testing
step of micro production. For the inspection of Micro(Opto)ElectroMechanicalSystems (M(O)EMS) a priori
information are available to optimise the inspection process. The EU-project SMARTIEHS develops a new concept for
high volume M(O)EMS testing. The design of the test station and the fabrication of the first components are presented
and the advancements compared to the state of the art are introduced within the following fields: micro-optical
interferometer design, micro-optical production, smart-pixel camera and mechanical design. Furthermore the first
demonstrators are introduced and experimental results are presented.
We present a semi-analytical model of optical coherence tomography (OCT) taking into account multiple scattering. The model rests on the assumptions that the measured portion of the backscattered sample field is spatially coherent and that the sample is motionless relative to measurement time. This allows modeling an OCT signal as a sum of spatially coherent fields with random phase arguments-constant during measurement time-caused by multiple scattering. We calculate the mean OCT signal from classical results of statistical optics and a Monte Carlo simulation. Our model is shown to be in very good agreement with a whole range of experimental data gathered in a comprehensive study of cross-talk in wide-field OCT realized with spatially coherent illumination. The study consists of depth scan measurements of a mirror covered with an aqueous suspension of microspheres. We investigate the dependence of cross-talk on important optical system parameters, as well as on some relevant sample properties. We discuss the more complex OCT models based on the extended Huygens-Fresnel principle, which rest on different assumptions since they assume partially coherent interfering fields.
The crucial role played by the source's degree of spatial coherence in wide-field optical coherence tomography is shown experimentally. Spatially coherent illumination, as obtained with a pulsed laser, generates a considerable amount of coherent optical cross-talk. The latter can be suppressed with spatially incoherent illumination as provided by a thermal or a pseudothermal light source. Demonstration is made for a US air force resolution target covered with a scattering solution made of polystyrene microspheres suspended in water. The origin and nature of cross-talk signals are discussed, as well as specific limitations of spatially incoherent sources.
In view of future generations of biosensors, immobilization of biomolecules with high spatial resolution onto selected materials or transducer surfaces is required. One way to attach the biomolecules is to induce covalent bonds with the substrate using a photochemical effect. High localization in the attachment is obtained when performing the photochemistry in the next field. In this paper, we present patterns of covalently bond proteins, written with near field UV activation. Observation is done in the near field as well, using near field fluorescence microscopy.
KEYWORDS: Near field scanning optical microscopy, Near field, Near field optics, Molecules, Luminescence, Optical microscopy, Glasses, Nanoprobes, Image resolution, Chromium
Applications of scanning near field optical microscopy to the imaging and the structuring of biomolecules is presented. The paper introduces the technique and presents images of a test grating, showing the potential of the technique for subwavelength imaging in air as well as in water. A sub- micrometer size fiber tip characterized by its high transmission is presented as an interesting probe for near field fluorescence microscopy. The potential of the technique is exploited to detect bioactive molecules that have been marked with a fluorescent probe and photoimmobilized onto a glass substrate using near field UV-activation of a photolinker.
Optical low coherence reflectometry (OLCR) is applied to the precise characterization of Bragg gratings in optical fibers. Grating with lengths below two millimeters have been fabricated in standard telecommunication fibers. Their OLCR spectra can be used to determine the induced index changes, which range from 0.64*10-3 to 1.16*10-3, with an accuracy of a few percent. These changes are obtained by adjusting the position of the oscillation minima in the OLCR spectra.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.