Dr. Peter Heftberger
at RO-RA Aviation Systems GmbH
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 22 March 2021 Presentation + Paper
Proceedings Volume 11593, 115930B (2021) https://doi.org/10.1117/12.2583208
KEYWORDS: Semiconducting wafers, Safety, Optical simulations, Numerical analysis, Failure analysis, Structural health monitoring, Numerical simulations, Electromagnetic coupling, Transducers, Sensors

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