Elimination of photomask defects requires identifying the sources of contaminants at each process step. Current industry practice is to perform defect inspection at the end of processing. This makes determining the source of defect generators extremely difficult. This paper presents data taken from inspections performed immediately following the principal processing steps done in photomask manufacture. The KLA-Tencor SLF27 TeraStar™ inspection tool was used to inspect a generic test pattern after developing, etching and stripping of the resist.
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