We demonstrate a C-band gain-switched seed laser intended for a EDFA-based fiber laser meeting the performance, footprint, robustness, and cost targets for volume time-of-flight LiDAR systems. The technology reported here leverages Freedom Photonics high-power DFBs coupled with a Black Forest Engineering control ASIC in a low-inductance package. As a result, the overall package is a compact form factor that can fit within a 16-pin butterfly package. To date, our 1550 nm seed technology delivers more than 2.5 nJ pulse energy for a 480KHz repetition rate on a 4 ns pulse, which is 30 times higher than conventional seed lasers. This technology is the first of its kind to realize a 1550 nm high-pulse energy seed laser for volume deployment of time-of-flight fiber-laser-based LiDAR systems.
We present a high-power DFB technology that meets the performance and volume demands of consumer automotive applications. Our DFB design is hardened and intended for use at extreme environmental conditions and operates at peak current density of 8 kA/cm2 - approximately 4 times higher than more conventional DFB lasers intended for use in telecommunication and sensing applications. We demonstrate that the risks associated with placing these components into high volume production with high yield can be managed through careful control of the laser design and manufacturing processes. To date, we show >90% of our DFB lasers fall within our control limits as defined by three sigma of the mean. This is the first high-power DFB laser suitable for widespread deployment into the consumer automotive market space.
Photonic wire bonding is a disruptive technology that solves the problem of efficiently coupling light between best-inbreed integrated photonic chips, providing insertion losses unattainable with other hybrid integration techniques. Enabled by advances in machine vision technology, photonic wire bonding uses two-photon polymerization to print a waveguide with arbitrary 3D geometry for connecting dissimilar integrated waveguides. Unlike butt-coupling hybrid integration approaches, specialized waveguide edge couplers and precise alignment between chips are not required since the photonic wire bond (PWB) is customized to a given pair of waveguides. The machine vision system detects the onchip waveguide facet locations and orientations for accurate placement of the PWB. Mode converters in the PWB efficiently transition light between the dissimilar optical spatial modes. Other hybrid integration approaches, including butt-coupling, flip-chip bonding, direct wafer bonding, and heteroepitaxy cannot achieve comparable insertion losses and are limited in their applicability and throughput. Freedom Photonics (a Luminar company) has demonstrated worldclass coupling losses between best-in-breed photonic platforms using a photonic wire bonding tool from Vanguard Automation. In this paper, we present photonic wire bond results between high performance semiconductor lasers and silicon nitride and lithium niobate waveguides as well as opportunities for prototyping of next generation, highly integrated photonic sub-assemblies.
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