Mr. Stephen P. Osborne Profile

Stephen P. Osborne

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Publications (6)

Proceedings Article | 17 April 2012 Paper

Cleaning aspects of material choice for high end mask manufacturing

Pavel Nesladek, Steve Osborne, Stefan Rümmelin

Proceedings Volume 8352, 83520S (2012) https://doi.org/10.1117/12.920564

KEYWORDS: Particles, Extreme ultraviolet, Contamination, Photomasks, Manufacturing, Interfaces, Quartz, Chromium, Inspection, Phase shifts

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After decades of binary mask manufacturing using Cr absorber the material spectrum was extended by phase shift material in late 90's during introduction of Half Tone Phase Shift Masks (HT-PSM). This change had strong impact on manufacturing flow as well as several unit processes. A consequences of phase shifter introduction was the necessity of introducing a second level litho process, as well as introducing of dry etch processes due to poor etch properties of MoSi using wet chemistry. Less obvious and rather unremarkable was the impact of this change to clean processes, except the impact of the clean process on the phase shift. In recent years we've seen several new materials based on varying chemical composition as well as thickness of the absorber developed by various mask blank vendors namely Hoya and ShinEtsu. These materials are improving resolution, pattern fidelity and to some degree also mask lifetime. Adding the EUV mask blank materials increases further the spectrum of materials, taking into account all the absorber stacks available today on market. Thorough investigation of the clean process performance as a function of surface material shows significant variation in the critical parameters as defectivity, susceptibility to recontamination and relative cleaning efficiency. Goal of this work is to 1) Compare the already mentioned clean related properties together with feature damage and impact on the critical dimension (CD) shift for different materials. 2) Find a compromise between the technology requirements and process limitations resulting from the combination of available processes with material properties. Some aspects of the new materials such as stack height and interface between absorber and substrate are making this task easier, especially with respect to feature damage. On the other hand the most critical parameter - the cleaning efficiency, dropped due to the introduction of the new materials, mainly due to unfavorable sticking coefficients of these materials.

Proceedings Article | 27 May 2009 Paper

Particle transport and reattachment on a mask surface

Pavel Nesladek, Steve Osborne, Christian Kohl

Proceedings Volume 7470, 74700B (2009) https://doi.org/10.1117/12.835173

KEYWORDS: Particles, Photomasks, Information operations, Thin film coatings, Mask cleaning, Semiconducting wafers, Optical tracking, Optical microscopy, Head, Fluid dynamics

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Proceedings Article | 3 May 2007 Paper

Damage free megasonic resonance cleaning for the 45nm design rule

Steve Osborne, Valentine Baudiquez, Thomas Rode, Christian Chovino, Hidekazu Takahashi, Eric Woster

Proceedings Volume 6533, 65331D (2007) https://doi.org/10.1117/12.736531

KEYWORDS: Particles, Cavitation, Acoustics, Head, Aluminum, Photomasks, Reflection, Reflectivity, Wave plates, Scanning electron microscopy

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Proceedings Article | 20 May 2006 Paper

Mask cleaning strategies: a continuous ion removal concept

Steve Osborne, Hidekazu Takahashi, Eric Woster

Proceedings Volume 6283, 628325 (2006) https://doi.org/10.1117/12.681772

KEYWORDS: Ions, Crystals, Ultraviolet radiation, Particles, Reticles, Mask cleaning, Air contamination, Photomasks, Ion exchange, Silicon

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Proceedings Article | 8 November 2005 Paper

Mask cleaning strategies: particle elimination with minimal surface damage

Steve Osborne, Matthias Nanningas, Hidekazu Takahashi, Eric Woster, Carl Kanda, John Tibbe

Proceedings Volume 5992, 59923G (2005) https://doi.org/10.1117/12.632151

KEYWORDS: Particles, Ultraviolet radiation, Phase shifts, Ozone, Reflectivity, Mask cleaning, Silicon, Ions, Reticles, Molybdenum

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Proceedings Article | 8 November 2005 Paper

Mask cleaning strategies: haze elimination

Steve Osborne, Matthias Nanninga, Hidekazu Takahashi, Eric Woster

Proceedings Volume 5992, 59923H (2005) https://doi.org/10.1117/12.632179

KEYWORDS: Ions, Ultraviolet radiation, Air contamination, Photomasks, Mask cleaning, Pellicles, Crystals, Particles, Control systems, Hydrogen

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Showing 5 of 6 publications

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