As flat optics become increasingly mainstream, there is high interest in improving patterning resolution, making new materials available, and lowering manufacturing costs for these components. Because of their maturity across the entire supply chain, 300 mm m offer one of the best opportunities to simultaneously achieve all of these goals. By leveraging existing tooling and knowledge from 300 mm CMOS patterning, the high-pattern resolution of immersion DUV mastering can be combined with nanoimprint lithography and etching to achieve pattern transfer to optical materials. Wafer scale CMOS metrology can also be leveraged to optimize process uniformity and repeatability. This talk will present imec’s recent developments in utilizing CMOS fab tools to pattern high-index dielectrics on 300 mm substrates.
Nano-Imprint lithography (NIL) is a powerful technology for low-cost, large area patterning of complex nano-features, including surface relief gratings and meta-structures for AR optical components. A full layer patterning module that includes a NIL process suited for mass manufacturing requires multiple capabilities: nano-imprint tools, materials, template fabrication, potentially pre- or post-imprint material deposition or removal and extensive metrology. Through its longstanding history in the semiconductor industry, imec has developed advanced mastering, deposition, and etch capabilities that can be paired with NIL process development for fully integrated patterning. In this talk, recent developments in integrated surface relief patterning on transparent 300 mm substrates will be presented. Because the fabrication itself is substrate agnostic, this capability can be transferred to other substrate material available at 300 mm to match the design requirements of a variety of diffractive optical components, such as refractive index tuning.
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