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Sungmin Ahn
at SAMSUNG Electronics Co., Ltd.
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Publications (1)
Proceedings Article | 3 October 2022 Poster + Paper
Machine vision system for alignment in die-to-wafer bonder
Jiyoung Chu, Minhwan Seo, Hyungjin Kim, Wondon Joo, Sungmin Ahn, Sangwoo Bae
Proceedings Volume 12222, 122220L (2022) https://doi.org/10.1117/12.2633000
KEYWORDS: Semiconducting wafers, Optical alignment, Beam splitters, Distortion, Prisms, Wafer bonding, Machine vision, Cameras
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