Dr. Timothy R. Groves Profile

Dr. Timothy R. Groves

Professor (Emeritus) at Univ at Albany

SPIE Involvement:

Author

Proceedings Article | 4 April 2011 Paper

Fast mask writers: technology options and considerations

Lloyd Litt, Timothy Groves, Greg Hughes

Proceedings Volume 7970, 79700X (2011) https://doi.org/10.1117/12.882945

KEYWORDS: Photomasks, Lithography, Electron beam lithography, Semiconducting wafers, Mask making, Optical lithography, Semiconductors, Optical proximity correction, Manufacturing, Beam shaping

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Proceedings Article | 3 April 2010 Paper

Operation and performance of the CNSE Vistec VB300 electron beam lithography system

J. Hartley, T. Groves, R. Bonam, A. Raghunathan, J. Ruan, A. McClelland, N. Crosland, J. Cunanan, K. Han

Proceedings Volume 7637, 76371Y (2010) https://doi.org/10.1117/12.848396

KEYWORDS: Semiconducting wafers, Electron beam lithography, Metals, Lithography, Contamination, X-ray fluorescence spectroscopy, Overlay metrology, Calibration, Monochromatic aberrations, X-rays

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At the end of 2008, the College of Nanoscale Science and Engineering (CNSE) formally accepted a Vistec VB300 Gaussian electron beam lithography system. The system is a key component of the overall lithography strategy of the College and complements existing state of the art tooling for 193nm immersion, Extreme Ultra Violet and nanoimprint. The demonstrated resolving power of the system easily exceeds that of the facility's optical scanners. Together with 300mm wafer compatibility, and a class 1 mini environment, the system is well poised to execute its primary mission of supporting a variety of programs in post CMOS device integration. For a 300mm tool to be able to exchange wafers with other tooling in a full flow line it is necessary to pass stringent backside metal contamination testing. TXRF (total reflection x-ray fluorescence) testing performed with 300mm wafers on the VB300 satisfied the permitted metal contamination levels and cleared the way for introduction of ebeam patterned wafers into the process flow. Most of the tooling in the 300mm line handles wafers in front opening universal pods (FOUPS). With the relatively low throughput of the system (hours per wafer, not wafers per hour), this type of interface is not required. In order to maintain a low level of defects, 300mm wafers are removed from the FOUPS in the class 1 mini environment and loaded into the system. In addition to the 300mm capability, the system supports a wide range of wafer sizes, photomasks and piece parts. This enables the platform to support the 200mm activities at the College as well as the small samples frequently encountered with novel materials that have no support tooling available for 200mm and 300mm wafer sizes. The VB300 platform readily met the Vistec standard acceptance test specifications. The paper presents details of the acceptance test together with examples of additional work in progress that includes implementation of rigorous tool monitor standards, imprint template fabrication and mix and match overlay between the VB300 and optical patterning tools.

Proceedings Article | 2 June 2004 Paper

Shaped beam technology for nano-imprint mask lithography

Peter Hudek, Dirk Beyer, Timothy Groves, Olaf Fortagne, William Dauksher, David Mancini, Kevin Nordquist, Douglas Resnick

Proceedings Volume 5504, (2004) https://doi.org/10.1117/12.568035

KEYWORDS: Electron beam lithography, Lithography, Photomasks, Photoresist processing, Etching, Chromium, Beam shaping, Nanotechnology, Image processing, Semiconducting wafers

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Proceedings Article | 2 June 2004 Paper

Proposal for a distributed parallel system for high-throughput maskless e-beam lithography

Timothy Groves, Daniel Pickard

Proceedings Volume 5504, (2004) https://doi.org/10.1117/12.568030

KEYWORDS: Electron beam lithography, Distributed computing, Lithography, Beam shaping, Magnetism, Optical spheres, Gold, Electron beams, Optical scanning systems, Optical lithography

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Proceedings Article | 19 May 1995 Paper

Performance of IBM's EL-4 e-beam lithography system

James Rockrohr, R. Butsch, W. Enichen, Michael Gordon, Timothy Groves, John Hartley, Hans Pfeiffer

Proceedings Volume 2437, (1995) https://doi.org/10.1117/12.209156

KEYWORDS: Photomasks, Calibration, Electroluminescence, Control systems, Magnetism, Electron beams, Analog electronics, Lithography, Electronics, Electron beam lithography

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Conference Committee Involvement (8)

Alternative Lithographic Technologies V

25 February 2013 | San Jose, California, United States

Alternative Lithographic Technologies IV

13 February 2012 | San Jose, California, United States

Alternative Lithographic Technologies III

1 March 2011 | San Jose, California, United States

Alternative Lithographic Technologies II

23 February 2010 | San Jose, California, United States

Alternative Lithographic Technologies

24 February 2009 | San Jose, California, United States

Showing 5 of 8 Conference Committees

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