Object tracking algorithms based on traditional cameras exhibit poor performance under conditions of complex backgrounds or significant lighting variations, whereas event cameras, which feature high temporal resolution and wide dynamic range, can overcome these limitations. This paper proposes an efficient and fast tracking and localization algorithm based on event streams. To be specific, a novel event-based fast corner detection algorithm has been designed to perform in a highly efficient and timely manner in high-speed dynamic and low-light conditions. Finally, the extended Kalman filter is chosen as the primary method for estimating the target’s motion state, thereby accomplishing the task of target tracking based on event stream information. Comprehensive evaluation results demonstrate that the proposed algorithm achieves high tracking success rates and low average processing times in various scenarios involving high-speed single and multiple target tracking.
Temperature is a significant control parameter in the silicon-based MEMS fabrication process, and the uneven distribution of the temperature on the surface of a silicon wafer can have a huge impact on the entire process. In this study, an FBG temperature sensing network was used to monitor temperature trends and abnormal temperature regions during the manufacturing process. The measurement of wafer surface temperature using FBG arrays often only records limited spatio-temporal temperature data, rather than the temperature distribution across the entire surface. Therefore, a reconstruction algorithm is needed to reconstruct the temperature field on the wafer surface. In order to find the optimal FBG sensor arrangement while improving the reconstruction accuracy of the wafer surface temperature field, this paper discusses the influence of the number of sensors and the sensors’ placement. COMSOL is used to simulate the process of wafer heating. Sparse temperature data are obtained by numerical calculations to reconstruct the temperature field with both linear and fan-shaped sensor position arrangements. The RMSE between the temperature field obtained by the optimized layout and the simulation results is smaller than 2.5°C. The FBG network layout proposed in this paper can provide an application basis for temperature field reconstruction in the MEMS manufacturing process.
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