Femtosecond laser direct writing technology is an advanced micro- and nano-fabrication technique widely used in the fabrication of semiconductor devices. To realize nano-fabrication, it is usually necessary to immerse a high-numericalaperture objective lens in water or oil to improve the focusing accuracy. However, the use of liquid media limits its wide application in semiconductor fabrication. The aim of this study is to develop a technique for nanoscale fabrication on silicon surfaces using femtosecond laser direct writing without the need for liquid immersion. In this work, a technique for modulating a tightly focused femtosecond laser using a micro-cylindrical lens is presented, which enables the fabrication of dual nanowires on a silicon surface in ambient air. By optimizing the height difference between the micro-cylindrical lens and the silicon wafer, the laser energy and the pulse frequency, a dual nanowire structure with a minimum feature size of 15 nm was prepared. The method is carried out in ambient air, simplifying the setup, and has potential application scenarios for affordable, ultra-high-precision, high-speed laser direct writing of semiconductors.
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