Prof. Xin Kang Profile

Prof. Xin Kang

at Putian Univ

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Author

Publications (10)

SPIE Journal Paper | 30 June 2021

Evaluating binary defocusing quantitatively in real-time for fringe projection profilometry

Xin Kang, Zhuoyi Yin, Shuai Dong, Cong Liu, Xiaoyuan He

OE, Vol. 60, Issue 06, 064110, (June 2021) https://doi.org/10.1117/12.10.1117/1.OE.60.6.064110

KEYWORDS: Binary data, Phase shifts, Fringe analysis, Projection systems, Optical engineering, Cameras, Numerical simulations, Imaging systems, Micromirrors, Point spread functions

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SPIE Journal Paper | 8 December 2017

Target-based calibration method for multifields of view measurement using multiple stereo digital image correlation systems

Shuai Dong, Shanshan Yu, Zheng Huang, Shoutan Song, Xinxing Shao, Xin Kang, Xiaoyuan He

OE, Vol. 56, Issue 12, 124102, (December 2017) https://doi.org/10.1117/12.10.1117/1.OE.56.12.124102

KEYWORDS: Calibration, Digital image correlation, Cameras, Imaging systems, 3D acquisition, Stereo vision systems, 3D metrology, Content addressable memory, Optical engineering, 3D image processing

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Proceedings Article | 26 January 2016 Paper

Response of piezoelectric laminated micro plates under the excitation of an ultrasonic wave

Xin Kang, Shuai Dong

Proceedings Volume 9903, 99031U (2016) https://doi.org/10.1117/12.2214138

KEYWORDS: Ultrasonics, Wave plates, Sensors, Aluminum nitride, Electrodes, Gold, Platinum, Silica, Analytical research, Mechanics

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Proceedings Article | 1 July 2013 Paper

Comparison of different image recognition methods for characterization of micro-gyroscopes

Sun Wei, Ting Yin, Xin Kang, Xiao-Yuan He

Proceedings Volume 8769, 87693Z (2013) https://doi.org/10.1117/12.2018478

KEYWORDS: Digital image correlation, Continuous wavelet transforms, Gyroscopes, Wavelets, Edge detection, Image processing, CMOS cameras, Motion measurement, Digital imaging, Sensors

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Proceedings Article | 25 August 2009 Paper

Influence of air viscous damping on beam-shaped micro-oscillator

Xin Kang, Zhanwen Xi, Dingguo Zhang

Proceedings Volume 7375, 73750Y (2009) https://doi.org/10.1117/12.839041

KEYWORDS: Ferroelectric materials, Ultrasonics, Microelectromechanical systems, Sensors, Switches, Analytical research, Optical simulations, Microresonators, Nickel, Mechanics

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SPIE Journal Paper | 1 November 2007

Speckle noise reduction in digital holography by multiple holograms

Chenggen Quan, Xin Kang, Cho-Jui Tay

OE, Vol. 46, Issue 11, 115801, (November 2007) https://doi.org/10.1117/12.10.1117/1.2802060

KEYWORDS: Holograms, Speckle, Digital holography, 3D image reconstruction, Speckle pattern, Denoising, CCD image sensors, Optical engineering, Mechanical engineering, Wavefronts

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Proceedings Article | 29 May 2002 Paper

Optical methods for the measurement of MEMS materials and structures

Xiaoyuan He, Xin Kang, Chenggen Quan, Cho Tay, Shihua Wang, Huai Shang

Proceedings Volume 4537, (2002) https://doi.org/10.1117/12.468778

KEYWORDS: Microelectromechanical systems, Micromirrors, Electrodes, Projection systems, Fringe analysis, Microscopes, Phase shifting, CCD cameras, Calibration, Speckle pattern

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Proceedings Article | 29 May 2002 Paper

New phase-unwrapping method and its application in shape measurement

Xiaoyuan He, Xin Kang

Proceedings Volume 4537, (2002) https://doi.org/10.1117/12.468869

KEYWORDS: Phase measurement, 3D modeling, Fringe analysis, Phase shift keying, Teeth, Phase shifts, Algorithm development, Mechanics, Modulation, Experimental mechanics

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Proceedings Article | 29 May 2002 Paper

Application of noncontact deformation measurement in mechanical properties study of MEMS

Xin Kang, Xiaoyuan He, Lin Liu

Proceedings Volume 4537, (2002) https://doi.org/10.1117/12.468759

KEYWORDS: Microelectromechanical systems, Speckle, Speckle pattern, Microscopes, Reliability, Copper, CCD cameras, Mechanics, Optical metrology, Experimental mechanics

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SPIE Journal Paper | 1 August 2001

Coplanarity study on ball grid array packaging

Cho Tay, Xiaoyuan He, Xin Kang, Chenggen Quan, Huai Shang

OE, Vol. 40, Issue 08, (August 2001) https://doi.org/10.1117/12.10.1117/1.1386639

KEYWORDS: Packaging, CCD cameras, Cameras, Digital imaging, Digital image correlation, Mechanical engineering, Product engineering, Lenses, In situ metrology, Manufacturing

Showing 5 of 10 publications

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