Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards

Yasuo Nakagawa

doi:10.1117/12.933619

22 November 1982 Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards

Yasuo Nakagawa

Proceedings Volume 0336, Robot Vision; (1982) https://doi.org/10.1117/12.933619
Event: 1982 Technical Symposium East, 1982, Arlington, United States

Abstract

An automatic visual inspection technique for solder joints on printed circuit boards has been developed. To detect the solder joint shape, structured light is used as the optical system and a simple waveform processing is applied to the extracted shape for judging the shape of a solder joint.

Citation Download Citation

Yasuo Nakagawa "Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards", Proc. SPIE 0336, Robot Vision, (22 November 1982); https://doi.org/10.1117/12.933619

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