Paper
23 February 1987 A High-Frequency Laser Package For Microwave Optical Communications
L W Ulbrichta, J Schlafer
Author Affiliations +
Proceedings Volume 0716, High Frequency Optical Communications; (1987) https://doi.org/10.1117/12.937466
Event: Cambridge Symposium-Fiber/LASE '86, 1986, Cambridge, MA, United States
Abstract
The design and performance characteristics of a fiber-coupled microwave laser package suitable for optical transmission of broadband or RF signals are described. The package contains a GTE 15-GHz, VPR-BH diode laser coupled to a single-mode fiber; an InGaAs edge detector for monitoring rear facet power; temperature stabilizing components; and microstrip con-nections to the laser. The laser is placed in series with a 5041 transmission line that is terminated externally using a commercially available precision high-frequency load. Major features of the package include a laser carrier design that simplifies internal component assembly while maintaining stable laser-to-fiber alignment to ambients of 60°C, a flexible internal microstrip configuration that relieves expansion stresses at temperature extremes, a hermetically sealed environment free of organic com-pounds, and a reconfigurable RF port that is externally compatible with both coaxial and microstrip transmission media. Broadband performance of the package is currently dominated by the laser's 15-GHz frequency response. Circuit simula-tions of the internal microstrip and parasitic reactances indicate that inherent package bandwidth exceeds 20 GHz. Though overall bandwidth is dominated by the laser, packaging-related in-band ripple is affected by the internal microstrip, amounting to approximately 0.75 dB p/p. A variation of the basic package design incorporates a narrowband reactive impedance-matching network in close proximity to the laser for transferring maximum RF power while maintaining a VSWR that is less than 1.5:1.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L W Ulbrichta and J Schlafer "A High-Frequency Laser Package For Microwave Optical Communications", Proc. SPIE 0716, High Frequency Optical Communications, (23 February 1987); https://doi.org/10.1117/12.937466
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KEYWORDS
Laser packaging

Microwave radiation

Semiconductor lasers

Laser bonding

Diamond

Sensors

Connectors

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