Paper
8 September 1988 Microwave Interconnects Via Electromagnetic Coupling
John J. Burke, Robert W. Jackson
Author Affiliations +
Proceedings Volume 0947, Interconnection of High Speed and High Frequency Devices and Systems; (1988) https://doi.org/10.1117/12.947449
Event: Advances in Semiconductors and Superconductors: Physics and Device Applications, 1988, Newport Beach, CA, United States
Abstract
Two transitions are described which couple coplanar waveguide on one substrate surface (a motherboard) to either coplanar waveguide or microstrip on another substrate surface (a chip). No wire bonds are necessary. A coupled transmission line model, along with a full wave analysis, is used to predict the behavior of these transitions. Experimental results show good agreement with predictions in cases where the coupler length to width ratio is not too small.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John J. Burke and Robert W. Jackson "Microwave Interconnects Via Electromagnetic Coupling", Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); https://doi.org/10.1117/12.947449
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KEYWORDS
Microwave radiation

Waveguides

Electromagnetic coupling

Extremely high frequency

Silicon

Commercial off the shelf technology

Fourier transforms

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