Thermal characteristics of compact conduction-cooled high power diode laser array packages

Pu Zhang; Xingsheng Liu; Qiwen Zhu; Jingwei Wang

doi:10.1117/12.2250258

22 February 2017 Thermal characteristics of compact conduction-cooled high power diode laser array packages

Pu Zhang, Xingsheng Liu, Qiwen Zhu, Jingwei Wang

Proceedings Volume 10085, Components and Packaging for Laser Systems III; 100850A (2017) https://doi.org/10.1117/12.2250258
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

Thermal management is one of the most important factors affecting the performance of high power diode lasers. In this paper, transient thermal behavior of conduction-cooled high power diode lasers has been studied using finite element method. The effects of heat sink geometry, ceramics size on the junction temperature of high power diode laser packages have been analyzed. Based on the simulations, heat dissipation capability of high power diode laser packages is improved and compact conduction-cooled diode laser array packages with 3 bars and 5 bars are fabricated. The power ~ current and spectrum of the optimized high power diode laser array packages at different operation parameters are characterized at different pulse widths, repetition frequencies and TEC temperatures. The effects of temperature on the output power and spectrum are discussed. The lifetime test of high power diode laser array packages is also performed. It shows that the conduction-cooled high power diode laser array packages have good optical performance.

Conference Presentation

Citation Download Citation

Pu Zhang, Xingsheng Liu, Qiwen Zhu, and Jingwei Wang "Thermal characteristics of compact conduction-cooled high power diode laser array packages", Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850A (22 February 2017); https://doi.org/10.1117/12.2250258

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