Metallic junction thermoelectric device simulations

Adam J. Duzik; Sang H. Choi

doi:10.1117/12.2256675

17 April 2017 Metallic junction thermoelectric device simulations

Adam J. Duzik, Sang H. Choi

Proceedings Volume 10167, Nanosensors, Biosensors, Info-Tech Sensors and 3D Systems 2017; 101670P (2017) https://doi.org/10.1117/12.2256675
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2017, Portland, Oregon, United States

Abstract

Thermoelectric junctions made of semiconductors have existed in radioisotope thermoelectric generators (RTG) for deep space missions, but are currently being adapted for terrestrial energy harvesting. Unfortunately, these devices are inefficient, operating at only 7% efficiency. This low efficiency has driven efforts to make high-figure-of-merit thermoelectric devices, which require a high electrical conductivity but a low thermal conductivity, a combination that is difficult to achieve. Lowered thermal conductivity has increased efficiency, but at the cost of power output.

An alternative setup is to use metallic junctions rather than semiconductors as thermoelectric devices. Metals have orders of magnitude more electrons and electronic conductivities higher than semiconductors, but thermal conductivity is higher as well. To evaluate the viability of metallic junction thermoelectrics, a two dimensional heat transfer MATLAB simulation was constructed to calculate efficiency and power output. High Seebeck coefficient alloys, Chromel (90%Ni- 10%Cr) and Constantan (55%Cu-45%Ni), produced efficiencies of around 20-30%. Parameters such as the number of layers of junctions, lateral junction density, and junction sizes for both series- and parallel-connected junctions were explored.

Citation Download Citation

Adam J. Duzik and Sang H. Choi "Metallic junction thermoelectric device simulations", Proc. SPIE 10167, Nanosensors, Biosensors, Info-Tech Sensors and 3D Systems 2017, 101670P (17 April 2017); https://doi.org/10.1117/12.2256675

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