Paper
8 July 2019 Laser modulation simulation of micro-crack morphology evolution during chemical etching
Author Affiliations +
Proceedings Volume 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers; 110631H (2019) https://doi.org/10.1117/12.2540729
Event: Pacific Rim Laser Damage 2019 and Thin Film Physics and Applications 2019, 2019, Qingdao, China
Abstract
Subsurface micro-cracks will be generated during the grinding and polishing processes of optical components. Microcracks have a modulation effect on the laser, thereby reducing the laser damage threshold. The FDTD method is used to simulate the light intensity distribution modulated by micro-crack. By comparing the simulation results of radial crack, parabolic crack and elliptic crack, the modulation mechanism of micro-crack is revealed. The results show that for the crack with the same width and depth, light intensity enhancement factor (LIEF) modulated by radial crack on the rear surface and parabolic crack on the front surface is the largest; LIEF modulated by elliptical crack on the rear surface and radial crack on the front surface is the smallest. In addition, when the crack width-depth ratio is the same, the larger the depth, the higher the LIEF. As the width-depth ratio increases, the LIEF value increases firstly, then decreases, and finally approaches a stable value.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhi Chen, Huapan Xiao, Zhibin Li, Na Yu, Hairong Wang, and Rongguang Liang "Laser modulation simulation of micro-crack morphology evolution during chemical etching", Proc. SPIE 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers, 110631H (8 July 2019); https://doi.org/10.1117/12.2540729
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KEYWORDS
Modulation

Glasses

Optical components

Wet etching

Etching

Laser induced damage

Optical simulations

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