Paper
20 March 2020 A hybrid total measurement uncertainty methodology for dual beam FIB/SEM metrology
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Abstract
Dual beam focused ion beam/scanning electron microscopy (FIB/SEM) is a key characterization technique for rapid process development of electronic devices with complex geometry such as magnetic read/write heads in hard disk drives (HDD). Despite the destructive nature of FIB/SEM, it is still used as an in-line metrology technique supporting high volume manufacturing (HVM) process control. To overcome the throughput limitation of this technique and minimize the impact on product shipment time, it is a common practice to have a fleet of FIB/SEM tools in line. Hence, controlling the total measurement uncertainty (TMU) for the reference metrology fleet is essential. However, the existing TMU evaluation methods are mainly developed for non-destructive or less-destructive metrology techniques, which allows measurement repetition. [1], [2]
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Ardavan Zandiatashbar and Chester Chien "A hybrid total measurement uncertainty methodology for dual beam FIB/SEM metrology", Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 1132517 (20 March 2020); https://doi.org/10.1117/12.2552115
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KEYWORDS
Metrology

Ion beams

Process control

Semiconducting wafers

Scanning electron microscopy

Head

Ions

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