Presentation
5 March 2021 III-V-on-Si/SiN lasers realized using micro-transfer-printing
Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, Geert Morthier
Author Affiliations +
Abstract
Micro-transfer-printing (µTP) enables the intimate integration of diverse non-inherent functionalities on a target substrate and hence allows for the realization of complex photonic integrated circuits (PICs) with small footprint. By employing a polydimethylsiloxane (PDMS) elastomeric stamp with an array of posts, a large number of micro-components can be integrated on a target wafer in one transfer printing operation, which leads to substantial cost reduction of the resulting PICs. This paper discusses the use of µTP for the realization of III-V lasers on Si and SiN PICs and summarizes the recent progress that has been made in this field.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Bart Kuyken, Dries Van Thourhout, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Agnieszka Gocalinska, Stijn Cuyvers, Emanuele Pelucchi, Brian Corbett, Artur Hermans, Antonio Jose Trindade, Chris Bower, Roel Baets, Gunther Roelkens, and Geert Morthier "III-V-on-Si/SiN lasers realized using micro-transfer-printing", Proc. SPIE 11705, Novel In-Plane Semiconductor Lasers XX, 117050J (5 March 2021); https://doi.org/10.1117/12.2577157
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KEYWORDS
Photonic integrated circuits

Silicon

Tunable lasers

Semiconducting wafers

Semiconductor lasers

Laser applications

Optical interconnects

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