Velocity-region dual adaptive path planning for ICP jet processing of ultra-thin optical elements

Yuan Jin; Peng Ji; Bo Wang; Fei Ding; Zheng Qiao; Duo Li

doi:10.1117/12.2617328

15 February 2022 Velocity-region dual adaptive path planning for ICP jet processing of ultra-thin optical elements

Yuan Jin, Peng Ji, Bo Wang, Fei Ding, Zheng Qiao, Duo Li

Proceedings Volume 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021); 121664L (2022) https://doi.org/10.1117/12.2617328
Event: Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 2021, Hong Kong, Hong Kong

Abstract

Over the past few years, atmospheric Inductively Coupled Plasma (ICP) has aroused extensive attention in optical fabrication field since its chemical etching-based processing mode does not mechanically damage work-pieces. However, the principle of chemical etching will inevitably bring some processing temperature while maintaining the efficiency. This makes the ICP jet easily cause thermal damage to the ultra-thin or low thermal conductivity optical elements, even cause the element to crack seriously. Therefore, this paper proposes a velocity-region dual adaptive path planning algorithm, which reduces the processing temperature by limiting the moving velocity of a single path, and achieves the removal of excessive peaks through Repeated traversals.

Citation Download Citation

Yuan Jin, Peng Ji, Bo Wang, Fei Ding, Zheng Qiao, and Duo Li "Velocity-region dual adaptive path planning for ICP jet processing of ultra-thin optical elements", Proc. SPIE 12166, Seventh Asia Pacific Conference on Optics Manufacture and 2021 International Forum of Young Scientists on Advanced Optical Manufacturing (APCOM and YSAOM 2021), 121664L (15 February 2022); https://doi.org/10.1117/12.2617328

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KEYWORDS

Optical components

Plasma

Atmospheric plasma

Calibration

Transmission electron microscopy

Wet etching

Computer simulations

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