Paper
25 April 2022 Reactive ion etching and deep reactive ion etching processes
YiHan Wu, HaiLin He
Author Affiliations +
Proceedings Volume 12244, 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022); 1224406 (2022) https://doi.org/10.1117/12.2634681
Event: 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 2022, Guilin, China
Abstract
Semiconductor technology is a new technology that has only begun to develop in recent decades, but after just a few decades of development, it has become one of the largest industries in the world today, and it exists in many products in our daily lives. In the last few years, the demand for semiconductors surged, even in automobiles, computers and other industries. Due to the shortage of semiconductor chips, a chain shortage effects are caused in many other fields. Therefore, advanced semiconductor technology is very urgent. In semiconductor technology, etching technology accounts for about one-third of the total process capital cost and a large amount of time cost. The reactive ion etching and deep reactive ion etching in this paper are the most advanced techs among all etching technologies today. This paper first explained the mechanisms of the two technologies, and analyzed etching performance with various influencing factors.
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YiHan Wu and HaiLin He "Reactive ion etching and deep reactive ion etching processes", Proc. SPIE 12244, 2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 1224406 (25 April 2022); https://doi.org/10.1117/12.2634681
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KEYWORDS
Etching

Reactive ion etching

Silicon

Fluorine

Silica

Deep reactive ion etching

Ions

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