Curved-edge diffractive fringe pattern analysis for wafer edge metrology and inspection

Kuan Lu; Zhikun Wang; Heebum Chun; Chabum Lee

doi:10.1117/12.2665016

27 April 2023 Curved-edge diffractive fringe pattern analysis for wafer edge metrology and inspection

Kuan Lu, Zhikun Wang, Heebum Chun, Chabum Lee

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124960G (2023) https://doi.org/10.1117/12.2665016
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

A novel wafer edge quality inspection method based on analyzing curved-edge diffraction patterns is introduced in this paper. The diffraction patters, being collected through two approaches: (1) single point scanning method and (2) areal imaging method, are affected by edge topography, edge geometry and defects. After applying statistical feature extraction methods and wavelet transform to the collected fringe data, corresponding features of various defect modes were further extracted. In summary, both proposed methods enabled characterization and identification of various wafer edge defect modes and shed light on automatically wafer edge defects detection and categorization.

Conference Presentation

Citation Download Citation

Kuan Lu, Zhikun Wang, Heebum Chun, and Chabum Lee "Curved-edge diffractive fringe pattern analysis for wafer edge metrology and inspection", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124960G (27 April 2023); https://doi.org/10.1117/12.2665016

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