Chemical trimming overcoat: an advanced spin-on process for photoresist enhancement in EUV lithography

Xisen Hou; Yinjie Cen; Paul Baranowsky; Doris Kang; Cong Liu; Chengbai Xu

doi:10.1117/12.2658882

30 April 2023 Chemical trimming overcoat: an advanced spin-on process for photoresist enhancement in EUV lithography

Xisen Hou, Yinjie Cen, Paul Baranowsky, Doris Kang, Cong Liu, Chengbai Xu

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 124980Q (2023) https://doi.org/10.1117/12.2658882
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

The semiconductor industry is on the rise of maturing EUV lithography in high volume manufacturing (HVM). There remain, however, challenges to be overcome in the advancement of photoresist to improve yield and reduce cost of ownership. Herein, we report a novel chemical trimming overcoat process as a post-lithography spin-on solution to enhance EUV photoresist performance, enabling effective photospeed reduction as well as process window enhancement, such as reducing bridging defect at underdose. This is a highly versatile and tunable process for most chemically amplified photoresists, therefore allowing it to become a general process for a wide range of applications across EUV lithography.

Conference Presentation

Citation Download Citation

Xisen Hou, Yinjie Cen, Paul Baranowsky, Doris Kang, Cong Liu, and Chengbai Xu "Chemical trimming overcoat: an advanced spin-on process for photoresist enhancement in EUV lithography", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124980Q (30 April 2023); https://doi.org/10.1117/12.2658882

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