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1 May 2023 Opportunities and challenges of heterogeneous integration: from IC packaging POV
Jeffery Chiang, Paul Wu
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Proceedings Volume 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; 124990N (2023) https://doi.org/10.1117/12.2659852
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
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Abstract
The IC assembly industry has gone a full circle over the course of 50 years. At the beginning, everything was discretely packaged, but with the introduction of integrated circuits and advancement of lithograph y technologies, we were able to keep putting more into less., Yet the industry is facing challenges in continuing the scaling trend without sacrificing th e economic gain, therefore they turned to the heterogeneous integration, where the different IP blocks on the SOC were, once again, split into several discrete IC chips, thereby completing the circle. How do we enable these physically separated chips to have a performance that is on par with a single SOC? The answer is advanced packaging.
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Jeffery Chiang and Paul Wu "Opportunities and challenges of heterogeneous integration: from IC packaging POV", Proc. SPIE 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, 124990N (1 May 2023); https://doi.org/10.1117/12.2659852
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