EUV reflective coherent diffraction imaging system for wafer metrology

Tao Shen; Paolo Ansuinelli; Iacopo Mochi; Young Woo Kang; Jinho Ahn; Yasin Ekinci

doi:10.1117/12.2673832

15 August 2023 EUV reflective coherent diffraction imaging system for wafer metrology

Tao Shen, Paolo Ansuinelli, Iacopo Mochi, Young Woo Kang, Jinho Ahn, Yasin Ekinci

Proceedings Volume 12618, Optical Measurement Systems for Industrial Inspection XIII; 126180N (2023) https://doi.org/10.1117/12.2673832
Event: SPIE Optical Metrology, 2023, Munich, Germany

Abstract

Nanoscale non-destructive metrology is a key requirement in several steps of the manufacturing process of modern semiconductor devices. In particular, with the introduction of EUV lithography into the high-volume manufacturing, enabling further shrinking of feature sizes, metrology for future technology nodes will become increasingly challenging. Depending on the specific requirements and constraints of the metrology tasks, the choice of the measurement methods is critical, and sometimes limited. Conventional metrology techniques must be constantly adapted to keep up with the device scaling roadmap. To explore new and easily scalable methods for semiconductor wafer metrology, we developed the EUV reflective grazing-incidence nanoscope (REGINE). REGINE is a lensless nanoscope prototype that combines reflectometry, scatterometry and coherent diffraction imaging (CDI) in a single instrument. Being a lensless imaging system, it is compact, cost-effective, and free of lens-induced aberrations. In this work, we will present the REGINE system and the latest results of reflectometry, scatterometry and EUV pellicle transmission experiments.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Tao Shen, Paolo Ansuinelli, Iacopo Mochi, Young Woo Kang, Jinho Ahn, and Yasin Ekinci "EUV reflective coherent diffraction imaging system for wafer metrology", Proc. SPIE 12618, Optical Measurement Systems for Industrial Inspection XIII, 126180N (15 August 2023); https://doi.org/10.1117/12.2673832

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