Deep-ultraviolet lithography for 500-nm devices

Steven J. Holmes; Ruth Levy; Albert S. Bergendahl; Karey L. Holland; John G. Maltabes; Stephen E. Knight; Katherine C. Norris; Denis Poley

doi:10.1117/12.20180

1 June 1990 Deep-ultraviolet lithography for 500-nm devices

Steven J. Holmes, Ruth Levy, Albert S. Bergendahl, Karey L. Holland, John G. Maltabes, Stephen E. Knight, Katherine C. Norris, Denis Poley

Author Affiliations +

Proceedings Volume 1264, Optical/Laser Microlithography III; (1990) https://doi.org/10.1117/12.20180
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

Each DRAM design generation has required higher reoiution imaging and overlay capability. The 500-nm lithographic ground rules of a 16-Mb chip make deep-UV (DUV) an attractive alternative to,thc more stanth,rd mid-UV (MUV) photolithography presently practiced for less demanding technologies. The shorter wavelength permits an unproved depth of focus by allowing the same resolution at smaller numerical apertures. This approach retains the simplicity of single-layer-resist processing rather th a ii forcing conversion to m ultilayer imaging.

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Steven J. Holmes, Ruth Levy, Albert S. Bergendahl, Karey L. Holland, John G. Maltabes, Stephen E. Knight, Katherine C. Norris, and Denis Poley "Deep-ultraviolet lithography for 500-nm devices", Proc. SPIE 1264, Optical/Laser Microlithography III, (1 June 1990); https://doi.org/10.1117/12.20180

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