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12 July 2023 Laser beam soldering of exotic optic materials
G. Rosario Rodriguez, E. Beckert, M. Hornaff, T. Peschel, T. Schmidt, M. Heimberg
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Proceedings Volume 12777, International Conference on Space Optics — ICSO 2022; 127777G (2023) https://doi.org/10.1117/12.2691443
Event: International Conference on Space Optics — ICSO 2022, 2022, Dubrovnik, Croatia
Abstract
Low-stress bonding using the laser-based soldering technique Solderjet Bumping is presented for the assembly of optical systems. Selected systems include SQ1 and INVAR 36 (baseline system), CaF2 and 1.4371 stainless steel, BBO and Dilver P1, and KTP and Super Invar, the first two proposed as lens demonstrators and the other two as laser crystal demonstrators. Solder parameters found for the SQ1 and INVAR using the DoE method using 400μm SAC305 alloy with the desirability of 0.655, for BBO and Dilver P1 and CaF2 and stainless steel 1.4371 systems, parameters must be changed due to damage observed in the optical components. KTP and Super Invar system parameters are still under investigation. In the case of BBO, the parameters were successfully found while CaF2 is still under investigation, changing the solder bump size due to the constant presence of damage in the samples. Finite elements simulations show that excessive stress occurs locally at the singularity of the soldered interface, but is still below the critical value, nevertheless, the survival of the demonstrators under environmental loads (Δ60 K, 600 g) is expected.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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G. Rosario Rodriguez, E. Beckert, M. Hornaff, T. Peschel, T. Schmidt, and M. Heimberg "Laser beam soldering of exotic optic materials", Proc. SPIE 12777, International Conference on Space Optics — ICSO 2022, 127777G (12 July 2023); https://doi.org/10.1117/12.2691443
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KEYWORDS
Laser soldering
Crystals
Astronomical imaging
Pulsed laser operation
Optical components
Diffractive optical elements
Laser bonding
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